A basic process for revising a client-supplied CAD database.
Not all designs start from scratch. Not all designs start with a schematic and then “ECO’ing” it into the PCB, and then working from there creating the board outline and placing the footprints, followed by routing and completing the design, generating all the necessary fabrication and assembly files.
Some designs, like the one described here, are provided by the client, and require changes. Typically, these would be a simple set of changes in the schematic that need to be transferred via engineering change orders (ECO) to the PCB layout, followed by a series of updates on the PCB side to incorporate any parts added or deleted from the design.
Will a “universal” footprint work for various-sized passives?
This details the design of an LED constant-current driver PCB. I am trying to make this design as “universal” as possible. Described here are some of the features and reasons I created the layout as I did.
A review of five useful tools and the basis for using each.
What is the prominent skill process engineers are on the payroll for? It’s their problem-solving skills. Therefore, the process engineer’s function is to solve problems and add value. The better the process engineer becomes at doing this, the more valuable they become. The scientific method is a structured approach to problem-solving that can aid the process engineer in this endeavor.
A study of nearly 300 companies reveals shifting approaches to hardware and software.
How are companies addressing digital transformation, ever-increasing design complexity and the effects of a post-pandemic world on tech companies amid the so-called “Great Resignation?” This year, our technology-led analyst firm, Lifecycle Insights, conducted an in-depth independent study to learn more about and better understand what the coming years hold for engineering. The survey collected responses from 274 companies that design products across all major industries, with revenues ranging from $1 million to over $5 billion.
To say the Covid-19 pandemic is having lingering effects on how companies are operating in the “new normal” of a post-pandemic world is a tremendous understatement. Technology continues to advance rapidly in a time of historic levels of digital transformation. Evolving markets for electric vehicles, IoT devices, 6G, miniaturization, and more are increasing the need for systems and product design flows and tool capabilities without pause. Digital twins, artificial intelligence (AI) and augmented reality (AR) are terms we use daily, and product and systems design flows developed to accelerate first-pass design success are continually evolving.
A study of the influence of design parameters that impact success.
A microvia is defined in IPC-T-50M as “a blind structure (as plated) with a maximum aspect ratio of 1:1 when measured in accordance with FIGURE 1, terminating on or penetrating a target land, with a total depth (X) of no more than 0.25mm [0.00984 in] measured from the structure’s capture land foil to the target land.”
Advantages to using microvias in PCB design include but are not limited to signal integrity, routing real estate, and pin escape. The most common reason that drives designs to use microvias is the need to escape the pins of a fine-pitch part. As pin pitch on an integrated circuit (IC) is reduced, the design starts to approach a threshold where mechanically drilled vias are not possible. When this happens, other routing solutions such as microvias are required. Use of area array components with a pitch of less than 0.8mm will very likely require the use of microvias to escape the pins of the component, and these components are becoming common in high-reliability electronics such as space hardware and military/defense products. Another advantage is microvias can be used to make connections between two adjacent layers, thus saving a significant amount of routing real estate by not requiring a via that spans multiple layers as a mechanically drilled via typically would. And microvias help with signal integrity of high-speed digital or radio frequency (RF) circuits. At higher frequencies designs can be very sensitive to signal reflection caused by via stubs, and microvias may be required to mitigate signal integrity issues.
Salaries spiked in the past year. Can it last?
Inflation is hitting in all corners, but salaries are rising too. That’s according to the latest PCD&F/CIRCUITS ASSEMBLY salary survey of printed circuit designers and design engineers.
About 85% of those responding to the annual survey indicated their wages rose at least 1% in the past year, with more than 22% reporting hikes of seven percent or more. That’s an acceleration from 2021, when 47% of designers indicated their salaries were on the rise.