Apache Design Solutions has introduced Sentinel-PI chip-package-system design and analysis software, allowing SoC-Aware modeling and analysis of power delivery network for IC package and PCB designers.

The company claims that Sentinel-PI provides 3-D full-wave power network extraction and power integrity analysis for package and PCB designs, and allows designers to perform resistance check and static IR-drop analysis (DC), frequency-domain simulation, including impedance analysis of multi-port power delivery network of the chip, package and board (AC), and time-domain dynamic voltage drop analysis (transient).

“Semiconductor and system companies are looking to chip-package-system co-design to help mitigate risk, optimize cost, and improve productivity. Sentinel-PI is the company’s first product that addresses the system-wide power and noise challenges from IC, to package, to PCB.”

apache-da.com

Polar Instruments and Xact PCB have improved the integration of Speedstack controlled-impedance PCB stackup system and Gemini-X registration, prediction and control system.  The company claims that the integration of products decreases registration and distortion errors during stack-up design manufacturing processes.

The new link reportedly allows fabricators to view powerful visualizations of the stack-up, incorporating prediction of the layer scale factors, reducing engineering time and increasing the integrity and manufacturing yield of high-density PCBs.

Polar's Martyn Gaudion said, "Many of our customers are already using both tools side-by-side during PCB design. Integration allows them to access the capabilities of both systems in a single, more streamlined process."

http://www.polarinstruments.com