Homepage Slideshow

• BGA Pitch Impacts on Bare Board Fabrication

  A look at how array technology influences processes from board routing to drill to test.

  https://pcdandf.com/pcdesign/index.php/editorial/menu-features/14447-bga-pitch-impacts-on-bare-board-fabrication

• I Need a Stiffer Flex Circuit. What Do I Do?

  Material choices are often based on the planned assembly.

  https://pcdandf.com/pcdesign/index.php/current-issue/243-flexperts/14445-i-need-a-stiffer-flex-circuit-what-do-i-do

• An Ode to Pi

  Understanding key differences between time and frequency domains.

  https://pcdandf.com/pcdesign/index.php/current-issue/266-material-matters/14444-an-ode-to-pi

• Is Tight or Loose Coupling Best for Differential Signaling?

  Or should we just isolate noisy signals?

  https://www.pcdandf.com/pcdesign/index.php/editorial/menu-features/14371-is-tight-or-loose-coupling-best-for-differential-signaling

• Recent Advances in PCB Manufacturing Equipment

  More lasers and improved and integrated software have factories humming.

  https://pcdandf.com/pcdesign/index.php/current-issue/239-tech-tips/14446-recent-advances-in-pcb-manufacturing-equipment

• Common Design for Assembly ‘Gotchas’

  DfM means design for money. If it can’t be built, that’s a waste.

  https://pcdandf.com/pcdesign/index.php/current-issue/241-designer-s-notebook/14442-common-design-for-assembly-gotchas