The OptiCon Systems modular and flexible AOI system features a selectable camera configuration according to budget and performance requirements. The company claims a high fault detection at a minimal false call rate due to the use of flexible illumination, a modular camera configuration, advanced OCR functions and LASER height measurement. A telecentric lens and user-friendly debug tools results in claimed fast inspection results by the use of a manufacturing-oriented library structure that handles alternative components, with import modules for various placement data formats. The OptiCon systems can be used for automated optical inspection of mounted PCBs before or after the soldering process.
Circuit Suds has introduced an environmental-friendly biodegradable cleaner with claimed minimal environmental impact that is suitable for no-clean, rosin, and lead-free processes. The company claims that no special shipping or handling precautions are required, that the product is non-flammable and non-volatile, and that it can be disposed of as ordinary waste-water with a few exceptions. The company also states that the concentrate is suitable for a wide range of uses, from automated lines to hand-cleaning applications, and is available in one gallon, five gallon or larger containers.
JTAG Technologies has introduced the JT 37x7/RMI, a rack mount instrument that combines a boundary-scan controller and a 256 channel I/O tester in a compact 1U x 19" enclosure. The company claims the product incorporates the capability of their 'DataBlaster' boundary-scan controller with PCB testing plus flash, PLD device in-system programming, and the company's Digital I/O Scan (DIOS) technology.
The RMI can interface to a computer through one of three standard formats; USB 2.0, Ethernet 10/100 and IEEE 1394 Firewire. Test clock frequency is programmable up to 40 MHz, and TAP voltages can be set for a range of input and output characteristics.
Input and output voltage thresholds can be programmed to 1.5, 1.8, 2.5 or 3.3V allowing the testing of modern low-voltage logic families. The I/O channels are individually programmable as input, output, bi-directional or tri-state signals, and are grouped into blocks of 16. Any of the 16-channel groups can be bypassed, and selected channels can be interfaced with custom cabling to the UUT (low volume apps) or interfaced with bed-of-nails fixtures for efficiency and higher volume production.
The company claims that the product is fully compatible with existing JTAG tools and works with other industry standards, including National Instruments' LabVIEW, LabWindows and TestStand as well as custom C or C++ and Visual Basic test systems.
DownStream’s CAM350 Version 10 features claimed integration with Blueprint’s document authoring software to create and distribute the files required for a PCB fabrication and assembly release package, resulting in a single file for PCB post-processing. The company claims that the product can be used in the verification of design data prior to PCB fabrication and allows users distribute, view and extract documents, Gerber files, NC Drill/Mill data and panel designs for the manufacturing process.
IMPCO has introduced Polyflex FR fire-resistant resin for sealing electronic connectors, wires, and wiring assemblies against corrosion. The company claims that the product has water-wash capability and that their impregnation process creates a permanent flame-retardant barrier that can also prevent corrosion associated failures by filling gaps and pores in electronic connectors and wiring. The company states that the product is cured at temperatures below the threshold of sensitive components, and that the cured resin will not liquefy, melt, or burn. The company also states that the product does not require any special ventilation or handling during use, and has an indefinite pot life when properly stored. A UV-activated colorant allows identification of impregnated components, and the product has a claimed high flexibility and heat resistance and can be used in applications with frequent thermo-cycling and high vibration.
LKSoft introduces the 2nd edition of STEP-AP210 (ISO 10303-210) Electronic Assembly Interconnect and Packing Design used for product model data, to coordinate information regarding PCB procurement, design and fabrication and to standardize data exchange.
The company claims that tools for converting, viewing and editing of CAD/CAM data in the areas of mechanics (2D/3D), electrical installation, printed circuit boards and assembly, and the connecting of this information with PDM and PLM systems is included with the product.
LKSoft offers free 90 day licenses for everyone in June and July 2008. If you provide your feedback to LKSoft the license will be extended to a full year.