According to Lattice Semiconductor Corporation, the tool, ispLEVER® 7.1 includes functional and performance-enhancing features like an FPGA Simultaneous Switching Output (SSO) Analyzer. FPGA designers can analyze and optimize I/O pin placement and output switching characteristics to minimize undesirable noise and ground bounce on a printed circuit board. The design tool claims to deliver up to 30% faster FPGA design compile times and can support multi-processor powered design compilation to achieve the fastest timing closure.
A power calculator allows FPGA designers to analyze and optimize power requirements early in the design process. The Lattice Power Calculator includes a user-friendly interface that enables power analysis at the block level and examination of "what-if" scenarios by changing design environment variables.
GreenData Manager is a desktop application that can be used to manage green compliance data and documents. It helps collect and manage the full range of green compliance data such as RoHS compliance status and certificates from suppliers, material composition substance data, MSL and peak temperature data for Pb-free manufacturing, and tin-whisker mitigation strategies. GreenData Manager will validate compliance information against EU RoHS, China RoHS, Korea RoHS, Halogen-Free, and even the recent Norwegian PoHS. It can report the compliance status on all parts or BOMs. It will provide validation on the required material composition substances for each component and aggregate the status to products or BOMs. It can determine if test reports or certificates need to be recollected.
The ST10-LC909 polyimide product is a claimed price competitive replacement for Thermount and Copper Invar Copper, and is used to control the thermal expansion of PCBs.
According to the company, the product closely matches ceramic and flip-chip type low coefficient of thermal expansion (CTE) components, and that a multi-layer board manufactured using polyimide and Copper Invar Copper or Thermount materials can be duplicated using layers of standard polyimide and ST10-LC909 embedded into the PCB. The process will reportedly match the CTE of an existing design, targeting a range from 9ppm/°C to 12ppm/°C, with a low Z-axis expansion.
Christopher Associates Inc. has announced its introduction of the Machvision Hole Doctor verification system for printed circuit fabrication applications. The company states that the product is an in line conveyor system for the inspection and verification of hole count, hole diameter, location accuracy and hole quality on rigid, microvia/HDI, and flexible PCBs, and can be used after drilling, desmearing and plating or for final inspection or QC.
The company states the system can be programmed using a “golden board” or drill files to inspect hole diameters from .006” - .400” and up to 16:1 aspect ratios on panels from .010” to .400” thick. Claimed defect inspections include plugged holes, improper hole diameters, poor drilling accuracy, and other critical parameters using an XP-based SPC software package.
HC300 is constructed from a polyester resin with glass filament reinforcement. Flexible polyester additive claims increased toughness, and thin wall cross-sections without fracture. The material is claimed to be less rigid than 100% epoxy composites and compliant for most applications. In addition, polyester resin compliancy saves a claimed 35% on costs associated with mill bit replacement, as compared to typical epoxy resin materials.
Agilent Technologies Inc. has announced a 10x speed increase of its planar 3-D electromagnetic (EM) simulator, part of the Update 1 release of its Advanced Design System (ADS) EDA software platform. The speed improvement reportedly helps RFIC, RF module and high-speed gigabit serial-link designers take advantage of EM simulation for faster, more accurate design and signal integrity verification.
"The 10x speed improvement and meshing accuracy makes EM problem-solving possible for even very large and complex designs," said Jan Van-Hese, of the company's R&D division.