Printed Circuit Design & Fab Online Magazine - Current

Products

Agilent Technologies Inc. introduces the Transient-Convolution Simulator, able to achieve a three-fold simulation speed improvement for signal integrity simulations. It is reported to be the fastest signal integrity circuit simulator for multigigabit, high-speed data link design. Signal integrity designers can perform quick analyses with the high-capacity sparse matrix solver, and simulation times have been reported to be cut in half. Part of Agilent’s Advanced Design System (ADS) EDA software platform, applications include both design and verification of chip-to-chip multigigabit serial links.

www.agilent.com

Vishay Intertechnology Inc. introduces MKP 339 X2, MKP 338 2 X2 and MKP 336 2 X2, X2 electromagnetic interference (EMI) suppression film capacitors. They have a maximum voltage of 310 Vac as well as a large range of lead pitches and capacitance values. According to Vishay, the increased voltage rating still meets safety approvals, and the capacitor maintain the same compact dimensions. Lead pitches range from 7.5 mm to 27.5 mm, and capacitance values range from 1 nF to 4.7 μF. The capacitors are optimized for standard across numerous applications including power supplies, EMI filters and white goods. They are lead-free and RoHS compliant, with tinned wire leads.

www.vishay.com

Murata Electronics North America introduces MAGICSTRAP, an advanced Radio Frequency Identification (RFID) Tag that can be attached onto a PCB. It is inductively coupled to the antenna that is integrated into the PCB. Because no electrical contact is needed, MAGICSTRAP adheres directly to the PCB using glue or sticky tape. The circuitry allows for the impedance matching feature, needed to cover the total UHF bandwidth while complying with the EPCGlobal C1 G2 standard. It features high tolerance against Electro Static Discharge over 10kV and measures only 3.2mm by 1.6mm.

www.murata.com

Applied Nanotech Holdings introduces CarbAl, a carbon-based metal nanocomposite heat sink material. Reported to be three times more effective at diffusing heat, the material is comprised of 20% aluminum and 80% carbonaceous matrix, and it has a thermal transmission near 500 W/mK. The material is lighter than the traditional metallic heat sinks and provides low-cost, high-quality heat sinks for the microelectronic industry.

www.appliednanotech.net

IRphotonics introduces the iCure AS200, an inline fiber optic system that provides thermal spot curing. The portable unit offers infrared radiation that is easily and quickly absorbed by thermal epoxies, resulting in faster and stronger curing. In addition, a light guide allows for precise and localized heating of bonded assemblies, and the automated manufacturing process eliminates the need for multiple thermal ovens, thus reducing costs.

www.irphotonics.com

GOEPEL electronic introduces CION Module/DIMM240, a digital low-cost module that allows for the testing of signal and voltage supply pins of JEDEC Std. Compliant DIMM240 sockets for DDR2-SDRAM. The module can be plugged into a respective socket, enabling the interface stages’ voltages to be adapted automatically. In addition, the module comes with a transparent TAP that allows several boards of the same or differing types to be cascaded in a Daisy Chain configuration. Additional features include safety mechanisms that prevent damage in case of shorts, extended power yield and voltage programmable TAP, and the module is supported by all JTAG/Boundary Scan controllers from the ScanBooster and SCANFLEX families.

www.goepel.com