Oxford Instruments has released its new CMI165 Copper Thickness Measurement Gauge featuring temperature compensation. The hand-held device accurately measures hot or cold copper on PCBs, allowing for claimed in-process inspection regardless of the temperature of the Cu surface.
The CMI165 includes Oxford Instruments' proprietary SRP-T1 measurement probe tip and housing for guaranteed repeatability and reliability. The probe tip is fully replaceable without recalibration. The included spare probes render claimed minimal factory down time. The illuminated probe tip allows positioning on copper traces. Thin etched traces are accessible without the need for line width standards.
The gauge can measure foil, laminated, electroless or
electrodeposited copper thickness with direct digital readout in mils, microns or copper weight.
RFID's small chip size can reportedly allows PCB manufacturers real-time work-in-process visibility into parts, labor and finished goods throughout a manufacturing process. In addition, RFID solutions provide claimed an accurate comprehensive view of manufacturing data on units in production, including location, status, and time metrics.
Mikael Ahlund, of TI’s Instruments RFID Systems said, "The PCB tracking solution combines Texas Instruments' experience in electronics manufacturing along with our core competency in RFID with Omnitrol Networks' Work-In-Process application appliance."
"The Omnitrol PCB tracking solution…allows us to automatically maintain traceability on each component that goes into the products we build. We have been able to replace… manual scanning with a completely automated process," said Heinz Hornung, GM at TQ Components.
C-Boards focuses on rapid turnaround single sided boards, targeted specifically at prototype PCBs.