Products

Temperature stress during lead-free soldering processes can cause a yellowing of the solder resists and marking inks. Elpemer SD 2491 SM-TSW is yellowing-stable, white-opaque photoimageable solder resist with a claimed resistance to yellowing, and Elpemer SD 2691 TSW marking ink is applied by screen printing and developed in aqueous-alkaline media. The latter corresponds to the flame class V-0 according to UL 94, and meets the requirements of IPC-SM-840D and is halogen-free per JPCA-ES01-2003/IEC 61249-2-21.

 Lackwerke Peters, www.peters.de

GreenJet is reportedly the first fully digital solder mask printing system, said to replace conventional coating, drying, exposure and development processes. The printer reportedly will handle throughput of 60 sides per hour, at a maximum panel size of 24" x 30"and panel thickness of 0.4 to 10 mm. Printing resolution is 750 x 750dpi with zero tolerance/clearance, and the product is IPC approved in accordance with IPC-SM-840C and D.

http://www.printar.com

Oxford Instruments has released its new CMI165 Copper Thickness Measurement Gauge featuring temperature compensation. The hand-held device accurately measures hot or cold copper on PCBs, allowing for claimed in-process inspection regardless of the temperature of the Cu surface. 

The CMI165 includes Oxford Instruments' proprietary SRP-T1 measurement probe tip and housing for guaranteed repeatability and reliability. The probe tip is fully replaceable without recalibration.  The included spare probes render claimed minimal factory down time. The illuminated probe tip allows positioning on copper traces. Thin etched traces are accessible without the need for line width standards. 

The gauge can measure foil, laminated, electroless or electrodeposited copper thickness with direct digital readout in mils, microns or copper weight.

www.oxford-instruments.com

Omnitrol Networks and Texas Instruments Inc. (TI) announced an alliance delivering a radio frequency identification (RFID) product to PCB manufacturing applications. The product integrates Omnitrol Networks' Work-in-Process software and TI's Gen 2 RFID technology and provides electronic and contract manufacturers automated identifying and tracking of PCBs from the manufacturing floor to customer delivery. http://ti.com/pcbtracking

RFID's small chip size can reportedly allows PCB manufacturers real-time work-in-process visibility into parts, labor and finished goods throughout a manufacturing process. In addition, RFID solutions provide claimed an accurate comprehensive view of manufacturing data on units in production, including location, status, and time metrics.

Mikael Ahlund, of TI’s Instruments RFID Systems said, "The PCB tracking solution combines Texas Instruments' experience in electronics manufacturing along with our core competency in RFID with Omnitrol Networks' Work-In-Process application appliance."

"The Omnitrol PCB tracking solution…allows us to automatically maintain traceability on each component that goes into the products we build. We have been able to replace… manual scanning with a completely automated process," said Heinz Hornung, GM at TQ Components.

www.omnitrol.com

C-Boards can reportedly produce a printed circuit board from a PDF source file. The company claims that using a PDF source file is simpler and faster than using traditional Gerber files, and that the process allows the fabrication of a PCB in less than an hour.

C-Boards focuses on rapid turn­around single sided boards, targeted specifically at prototype PCBs.

www.cboards.co.za

FR408HR improved lead-free compatible, low-loss laminate has a thermally and electrically enhanced resin system. The material is designed to meet new designs challenges of high layer counts, heavier copper weights and those that require higher bandwidth. FR408 HR has a Tg of 200ºC, a decomposition temperature of 356ºC. This combination results in a 35% reduction in Z-axis expansion and a 25% improvement in dielectric properties over competitive products in its space.
Showed no degradation in performance after testing under multiple passes at 260ºC assembly after a prolonged exposure to high humidity and temperature on 5.5 mm thick very high layer count boards.

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