Printed Circuit Design & Fab Online Magazine - Current

Products

Hirose has released low-profile flexible printed circuit ZIF connectors, distributed by Digi-Key. The FH26 Series features a 0.3 mm contact pitch and vertical height 1 mm above board profile.

The connectors are said to be lightweight, with a typical 51 contact connector fully loaded weighing a claimed 0.1 gram, as well as having solder leads on a 0.6 mm pitch on the front and back of the connector allowing ease of solderability on a PCB. The company reports that conductive traces on the PCB can run under the connector with no exposed contacts.

Reported easy insertion and reliable connection are obtained from the company’s Flip Lock actuator that uses a tactile sensation when closed, confirming the electrical and mechanical connection.

The ZIF connector accepts standard thickness 0.2 mm standard Flexible PCB. According to the company, typical applications include mobile phones, PDAs, digital and video cameras, camera modules, LCD connections, plasma displays, and high-reliability ultra-small profile connectors.

http://www.hirose-connectors.com

Fujipoly announces the availability of its expanded Elastomeric Connector and Thermal Interface Material reference guide. The free product overview and technical design catalog contains performance data and installation suggestions for a wide variety of thermally conductive materials ranging from thin films and form-in-place materials to gap filler pads.

The product guide also features 19 pages of high density, low resistance, electrically conductive silicone connectors for consumer electronics and industrial applications.

www.fujipoly.com

Exopack Advanced Coatings’ Duratool Eclipse Micro Matte films reportedly use refined manufacturing and coating reformulations that incorporate more environmentally sensitive solvents.

In addition to claimed greater sustainability, the product reportedly provides PCB makers with better chemical and scratch resistance, as well as a high level of emulsion adhesion.

According to Greg Williams, VP at Exopack Advanced Coatings, “We are using just two reformulated coatings which significantly reduce the use of volatile organic compounds in the manufacture of these films."

Features of the new films include a claimed 100% camera inspection coupled with automatic web marking, superior resolution of 1000 lines/mm, excellent densitometry and coatings on a 0.007-inch polyester base for high stability and durability.

www.exopackadvancedcoatings.com

Engelmaier Associates presents the report Recommendations for PCB FAB Notes and Specifications in Printed Circuit Board Drawings for SnPb and Lead-Free Soldering Assemblies, the Qualification of PCB Shops and Activities to Assure Continued Quality.

Version v.08 makes recommendations regarding appropriate specifications and fabrication notes on drawings for printed circuit boards, general procedures to qualify PCB shops, and testing procedures to verify quality and reliability. Provides necessary material selection information to supplement IPC-4101 slash sheets. Contains recommended examples of fab notes for SnPb solder assemblies and Pb-free assemblies, for use as general specifications on PCB drawings, a basic questionnaire to supplement to IPC-1710 for qualifying PCB shops, and recommendations for ongoing activities to ensure qualified PCB shops maintain internal quality.

www.engelmaier.com

Agilent Technologies Inc. has released a limited access solution for In-Circuit Test (ICT) users that reportedly eliminates the need for physical test points. According to the company, Cover-Extend is part of the VTEP v2.0 powered test suite, and is a hybrid between the Boundary Scan test and VTEP Vectorless Test methodologies used in electronic manufacturing.

Cover-Extend uses stimulus provided by boundary scan cells, which do not require physical test points. The benefits include claimed improved test coverage, savings on fixturing operating cost, and strain relief on solder joints, resulting from fewer test probes needed underneath high-density ICs (e.g., BGAs).

"Cover-Extend addresses key concerns in today's manufacturing environment - cost, coverage, quality and speed," said Daniel Mak, VP and GM of Agilent's Measurement Systems Division. "The results we are getting from our customers' lines are very positive, and we will implement Cover-Extend in full-scale production environments…in April."

Agilent will conduct live demonstrations of Cover-Extend at two major test and inspection tradeshows: Apex 2008, April 1-3 in Las Vegas, NV, and Nepcon Shanghai 2008, April 8-11, Shanghai, China.

www.agilent.com

Tech-Etch has released the “V” Series variable finger snap-on BeCu gaskets for EMI/ RFI shielding. The company claims that by reducing the number of full snap-on fingers on a strip, shielding effectiveness is increased, since there are fewer gaps to close.

Claimed EMI/RFI shielding effectiveness is up to 100db attenuation. Each gasket is reportedly offered in five slot patterns with a snap-on mounting offering secure installation with high durability. The “V” Series is used in bi-directional applications, requires only a low closing force and closes gaps as small as .02”. Item numbers 187V32FXx, 250V37FXx and 282V60FXx are configurable to custom lengths.

www.tech-etch.com