Printed Circuit Design & Fab Online Magazine - Current

Products

Integrated Module Board technology permits smaller boards through adaptations to existing manufacturing processes. Components are embedded inside the core layer of the PCB, while being electrically connected directly to the conductors on top of the core layer. Can embed many types of components, including passives, bare die and wafer-level CSPs. Combines PCB manufacturing, component packaging and component assembly into one manufacturing sequence. Can be used to embed components inside a module substrate and manufacture a multi-chip-module / System-In-Package (SIP) product. Can be used to embed components inside a motherboard to manufacture a System-In-Board (SIB) product.

Imbera Electronics, http://www.imbera.fi

Mentor Graphics’ ECAD-MCAD Collaborator product enables bidirectional, digital communication of incremental design changes and automates the review and approval processes from design inception to manufacturing. Based on ProSTEP iViP Association-approved electromechanical interchange standard and developed in collaboration with PTC. Works in the Expedition Enterprise and Board Station XE PCB design flows, and PTC’s Pro/ENGINEER Wildfire 4.0 ECAD-MCAD Collaboration Extension.

Mentor Graphics, www.mentor.com

Rogers Corporation introduces RO3000 and RO4000 laminates that are antenna-grade, high-frequency circuit materials, featuring low passive intermodulation, low loss and higher thermal conductivity for improved power-handling capability. The RO3000 series is a PTFE-based circuit material that combines lower loss and minimal variation in dielectric constant and can be used in applications through 40 GHz. RO4000 laminates are glass-reinforced hydrocarbon/ceramic laminates that are reported to provide superior dimensional stability and tight dielectric-constant tolerance across the panel.

www.rogerscorporation.com

Agilent Technologies Inc. introduced SystemVue 2008, an electronic design automation (EDA) platform for electronic system-level (ESL) design. The platform is reported to reduce physical layer (PHY) design time by half for high-performance communications algorithms and system architectures for not only wireless, but also aerospace/defense applications. SystemVue offers an easy-to-use environment with links to hardware implementation and tests, as well as complements existing EDA tools used in FPGAs, DSPs and ASICs and Analog/RF components.

www.agilent.com

Sunstone Circuits launched LiveBOM, an interactive bill of materials functionality within PCB123 design software that supplies designers with real-time pricing, availability and technical part information from Digi-Key. The suite tracks the rolled up per-board pricing and quantity through either the Digi-Key or manufacturer part number.

"Partnering with Digi-Key to launch LiveBOM gives customers a more efficient and accurate way to make component purchasing decisions, which is the most expensive part of the prototype manufacturing process," explains Terry Heilman, CEO of Sunstone.

www.Sunstone.com

Advantest Corporation announced an optical-electrical printed circuit board technology that uses an optical waveguide technology to provide up to 160 gigabit-per-second, high-volume data transfer. Features include higher density mounting and wiring and electrical connection and waveguide coexistence. Advantest predicts a faster semiconductor tests system with higher packaging densities, and it plans to use the technology in practical applications by 2011.

www.advancedphotonics.com