Thermoset UR-288 urethane encapsulant cures at room temperature to produce a flame-retardant, semi-flexible material. Exhibits low shrinkage and stress on components as it cures, and maintains a low viscosity that reportedly achieves complete, void-free encapsulation. Suitable for curing at room temperature. Produces low exothermic heat rise during cure.

Lord Corp., lord.com/electronicmaterials

Magnas series printed circuit board plasma etching treatment system is said to require only three-phase power and compressed air for desmear and etch back applications. Features high etch speed rates and uniformity. Lowers CF4 usage.

Plasma Etch, www.plasmaetch.com

Sprint 120 provides consistent, volume production of legend designs. Is said to eliminate entire screen mask preparation process and require only one baking cycle. Achieves production quality in a single pass with precise drop control and optimized algorithms for fine text and filled areas. Custom print heads are designed for printed circuit boards and processes. UV LED lights enable drop curing on-the-fly and printing of features down to 0.5mm. Automatic measurements and scaling for each panel. Registration accuracy of 35μm.

Orbotech, www.orbotech.com

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Cupra Etch DE is based on iron sulfate etch and effectively removes the seed layer of electroless copper. Eliminates undercuts and reduces waste water. Retains contour of the finest conductors. Requires no "feed and bleed" operation. Does not etch three-dimensionally.

Atotech, www.atotech.com