Embedded Capacitance Material (ECM) C2006 thin laminate material has a capacitance density of approximately 20 nF per sq. in. Reportedly can improve power integrity and reduce electromagnetic interference in small devices such as microphones, sensors, IC packaging and interposers. Helps achieve high-fidelity signals, high signal-to-noise ratio in radio frequencies, and higher speed digital signals in high-performance applications.
3M Electronic Solution Division – Interconnect, www.3Mconnectors.com
OhmegaPly MTR permits thin-film resistors to be built within a printed circuit trace that is less than 100µm (0.004") wide. Uses standard subtractive printed circuit board processes; is reportedly ideal for HDI designs where passive component placement is difficult or impossible. Copper traces can be imaged and etched to define resistor widths, resulting in miniature resistors with consistent ohmic values. Are for line termination and pull-up/down applications. Delivers resistors to less than 50µm widths; 5µm and 17µm copper foil availability; resistor placement on plated surface or buried via layers.
Ohmega Technologies, www.ohmega.com
DataMan 50L compact barcode reader is designed for 1-D oriented barcode reading. Measures 23.5mm x 27mm x 43.5mm; features IP65-rated housing. Is reportedly ideal for mounting in tight spaces on production lines and in machinery. Equipped with Hotbars, image analysis technology. Read rates can surpass 99%. Has the ability to analyze “no reads” by letting the user see what the reader sees, live on a monitor or through image archiving. Is designed with no moving parts. Features three-position lens and integrated aimer.
Cognex, www.cognex.com/50L.aspx
TestWay software assesses defect opportunities and identifies possible consequences of inadequate testability and test coverage on a new design. Analyzes each stage of the design-to-delivery workflow. Checks ROHS, reliability, DPMO, BSDL file validation to guide component selection. Verifies electrical DfT guidelines. Includes standard checks and customer’s specific checks. Optimizes test probe placement according to test strategy definitions, estimates test coverage, models the cost, and calculates production yield and TL9000 initial return rates. Estimates test coverage using theoretical models for a range of test and inspection strategies. Exports CAD data into native format usable by assembly machines, AOI, automated x-ray, in-circuit testers, flying probe testers and boundary scan testers. Can read completed test program or test report and compare the coverage between the estimated and measured analysis.
Aster Technologies, www.aster-technologies.com
Power Management Bus (PMBus) IC programming solution supports devices from Linear Technologies and TI. Supplements SCIP (Serial Controlled IC Programmers). Runs on DataBlaster controllers and can be used to access PMBus pins via local boundary-scan-compliant devices or from an external DIOS (Digital IO Scan) module.
JTAG Technologies, www.jtag.com
Materials Library in the Speedstack PCB stack-up design and documentation system now includes Ventec’s VT464 halogen-free low-loss printed circuit board laminates. Can assess impact of Ventec’s laminates and prepregs. Collates cost and supplier data with design criteria such as dielectric thickness, transmission line or impedance specifications of different PCB materials.
Polar Instruments, www.polarinstruments.com