Bruce McWilliams, Tessera's chairman, president and CEO, said, "Tessera developed the MicroPILR platform to enable the ongoing evolution of electronics, which will require breakthroughs in interconnect to achieve greater levels of integration and functionality at lower levels of cost. Tessera is actively engaged with key members of the supply chain, including leading semiconductor manufacturers, subcontract assemblers, and materials suppliers, to drive widespread adoption of Tessera's MicroPILR platform. We look forward to offering our customers and the global electronics industry a powerful tool in meeting next-generation product roadmaps."