EP62-1 two-part epoxy is for adhesion, sealing or coating under harsh conditions. Is thermally stable, with a glass transition temperature exceeding 170°C. Has a working life of more than 12 hr. at ambient temperatures and a 100:10 mix ratio by weight. Features color coding. Cures rapidly at elevated temperatures, with schedules ranging from 4 to 6 hr. at 60°-70°C to 10 min. at 125°C. Is an electrical insulator with a volume resistivity exceeding 1014 ohm-cm and a dielectric constant of 3.25 at 60 Hz. Delivers tensile shear strengths greater than 2,300 psi and tensile strengths over 8,500 psi. Contains no solvents or diluents. Serviceable over the temperature range of -60°F to +450°F; has a shelf life of one year in unopened, original containers.

Master Bond, www.masterbond.com/tds/ep62-1
 

Material Disclosure software protects trade secrets about products and raw materials while providing supply chain traceability. Can upload reporting templates such as EICC-GeSI to a secure central database to create reports from consolidated supplier data. Works to increase response times from suppliers and automates querying suppliers on a regular basis, as well as gathering and storing data. Collects data on raw materials, including gold, tantalum, tin and tungsten. Data are collected at the bill of material level down to the substance level throughout the supply chain.

Actio, www.actio.net

XJTAG v. 3.0 boundary scan development software is faster and more intuitive. Features run-time enhancements which boost the speed of XJEase testing and device programming in XJDeveloper and XJRunner. XJAnalyser can now be used as an integrated function in XJDeveloper as well as in its standalone form. Now uses knowledge contained in an XJDeveloper project (netlist information, constant pin settings, etc.), and XJAnalyser can open XJDeveloper and XJRunner projects, while XJDeveloper can access the full functionality of XJAnalyser. JTAG Chain Debugger now integrated into XJDeveloper.

XJTAG, www.xjtag.com

Microfill LVF Via Fill electrolytic copper for enhanced microvia filling is for electrolytic copper plating of high density interconnect (HDI) printed circuit boards (PCB). Reportedly is capable of 10–15μm plating thicknesses, microvia filling, high filling efficiency and reduced copper usage. Improves panel and pattern plating distribution and features thermal reliability.

Dow Chemical Co. www.dow.com