A multitude of factors are conspiring to increase the amount of “noise” interference that can disturb the functionality and even damage electronic devices, starting with the sheer number used in our vicinity at any given time.
More than 20 years ago, material manufacturers were competing to develop adhesiveless copper-clad laminates for next-generation flexible circuits.
The original IPC Roadmap was designed to pave the way for a new era of US manufacturing dominance. Was it effective?