The redesign of a power adapter, using thermal modeling software.

Much has been written about the benefits of moving thermal design activity higher up the product development workflow to reduce the amount of rework needed later and eliminate physical prototyping for thermal reasons. That said, thermal considerations are normally indicated as advice or constraints on the main electrical and mechanical design flows.

A couple of weeks ago, I wrote about the printed circuit industry in Taiwan.

A multitude of factors are conspiring to increase the amount of “noise” interference that can disturb the functionality and even damage electronic devices, starting with the sheer number used in our vicinity at any given time.

Can wetting balance testing predict plating acceptability?