Next-generation devices will rely on 3-D interconnect technology and power “scavenging.”

Internet access, electrification, new safety requirements and autonomous vehicles are coming down the road.

With multiple assemblers involved in most projects, how can you speed up the development process?

During the 1980s, high-density flexible circuit manufacturers ran around the barn a few times trying to decide the best way to produce a reliable bond strength between polyimide sheets and copper foils when producing thin copper laminates for high density flexible circuits.