September 19, 2018 – Ventec International Group Co., Ltd. (6672 TT), a world leader in the production of polyimide & high reliability epoxy laminates and prepregs, announced that Alun Morgan, Chairman of the EIPC, has been named Technology Ambassador for Ventec International Group. In support of a common mission to promote the next generation’s progress in PCB material design, Alun will apply his extensive background and expertise in advocating for the Taiwan stock exchange listed company as an advisor and ambassador.

CHANDLER, Ariz.--(BUSINESS WIRE)--Rogers Corporation (NYSE:ROG), a global leader in engineered material solutions, announced today that Michael M. Ludwig has been appointed to serve as the Company’s new Senior Vice President, Chief Financial Officer and Treasurer effective September 17, 2018.

Waterbury, CT., September 18, 2018 – MacDermid Enthone Electronics Solutions (MEES), a MacDermid Performance Solutions business, will present at the 51st International Symposium on Microelectronics - IMAPS 2018. The conference will be held October 8-11, at the Pasadena Convention Center, Pasadena, CA, USA.

Wilsonville, OR, Sept. 17, 2018 -- Mentor, a Siemens business, today announced that the Xpedition™ and PADS® Professional printed circuit board design (PCB) design flows, including the Valor™ NPI and HyperLynx™ family of products, have each achieved ISO 26262 functional safety compliance.