Press Releases

WATERBURY, Conn, USA, July 13, 2018– MacDermid Enthone Electronics Solutions (MEES), a global electronics chemicals supplier, will present at the Advances in Thermal Management Conference which will take place at the Hyatt Regency Denver Tech Center, Denver, CO August 8-9, 2018. The conference gathers organizations in the electronics industry supply chain that depend on the precise dissipation of heat in electronic devices.

Read more: MacDermid Enthone to Present at the ‘Advances in Thermal Management’ Conference

Santa Clara, CA, July 12, 2018.  Cirexx International announced today that they have recently completed an upgrade to their MIL-PRF-31032 certifications.  The company now can certify more complex constructions to this specification.  The additional features include overall board thickness, minimum hole size and aspect ratio, minimum line width and space, conductive finish and panel size.   

Read more: Cirexx Obtains MIL-PRF-31032 Certification Upgrade

[July 12, 2018: New Bedford, MA] Epec Engineered Technologies has announced that it will be partnering up with the Wounded Warrior Project® (WWP) by hosting a fundraising campaign for the month of July. Epec will donate 5% of July’s sales from their online printed circuit board marketplace InstantPCBQuote to WWP.

Read more: Epec Partners with Wounded Warrior Project

July 10, 2018 – Ventec International Group Co., Ltd. (6672 TT), a world leader in the production of polyimide & high reliability epoxy laminates and prepregs, has appointed Peter Coakley as Sales Director UK. Effective July 1, Peter takes over the responsibility for the strategic leadership of UK sales activities that will contribute to the overall growth strategy of the company.

Read more: New Sales Director for UK at Ventec International Group

Front-loading of design intent and enhanced auto/interactive placement and routing boost performance, quality and manufacturability

Read more: Zuken CR-8000 2018 Boosts Process Efficiency in Advanced Single and Multi-board PCB Design

NESS ZIONA, Israel, July 09, 2018 (GLOBE NEWSWIRE) --  Nano Dimension, a leading additive electronics provider (Nasdaq, TASE: NNDM), announced today it has entered the Chinese market with a strategic partnership with the AURORA Group, a leading distributor of additive manufacturing systems. The AURURA Group will market and sell Nano Dimension’s award-winning DragonFly 2020 Pro 3D printer for electronics to customers in China.

Read more: Nano Dimension Partners with AURORA Group, China’s Leading Distributor of Additive Manufacturing...

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