San Diego, CA, US, March 13, 2018 – VPIphotonics and Computer Simulation Technology GmbH (CST), part of SIMULIA, a Dassault Systèmes brand, announce their partnership to seamlessly couple full-wave photonic device simulation and overall circuit simulation and analysis of integrated photonic components and subsystems within a single framework at OFC 2018, booths 4513 and 6117.

CHATSWORTH, CA – March 13, 2018 – NEO Tech, a leading provider of manufacturing technology and supply chain solutions for brand name OEMs in the industrial, medical and aerospace & defense markets, announces that it recently produced and published new and expanded guidelines for the manufacture of Low-Temperature Co-fired Ceramic (LTCC) and Aluminum Nitride (AlN) packaging solutions.

Master Bond is pleased to announce that the following epoxy compounds, EP17HTDA-1, EP21TDCHT, EP33, EP46HT-1AO, Supreme 11AOHT and Supreme 12AOHT-LO have passed MIL-STD-883J section 3.5.2., the subsection of the United States Military Standards set by the U.S. Department of Defense that refers to the thermal stability of a material.

Santa Clara, CA, Cirexx International announced today that they have acquired and installed an NTO (New Technology Overman) HASL (hot air solder leveling) system.  An original printed circuit board fabrication finish, solder had fallen out of favor over the past two decades in favor of RoHS compliance.  The DOD, however, continues to require solder as a PCB finish for many legacy, and some new, designs.  Defense contracting is a large and growing sector of Cirexx’s business and the company wanted the ability to control the scheduling and quality of this process in-house.