Press Releases

Recently acquired by Hindley Circuits, Irridian Industrial Electronics, the electronic design services business is now located within our Cramlington manufacturing facilities.

Read more: Irridian Invests in New Printed Circuit Board Design Software Suites

Irvine California, USA – TopLine will exhibit its groundbreaking CCGA and PID component technologies at the upcoming NEPCON South China 2018 conference and exposition, at the Shenzhen Exhibition Center, August 28 – 30, in Stand #1F13. This marks the 6th straight year that TopLine has exhibited at this show; TopLine has been active in promoting its products in the China market for more than 20 years.

Read more: TopLine to Exhibit CCGA and PID Technologies at NEPCON South China 2018

August 8, 2018 – Ventec International Group Co., Ltd. (6672 TT), a world leader in the production of polyimide & high reliability epoxy laminates and prepregs, announced the appointment of George Janosko responsible for Technical Sales for the Mid-West region of the USA.

Read more: George Janosko joins Ventec International Group Technical Sales Team for Mid-West USA

Connected, “smart” wearables such as rings, bracelets, clothing and shoes are benefitting from tiny RF chip antennas that take up less PCB space and allow for more miniaturized devices.

Read more: Miniaturizing Smart Wearables for Fitness and Activity Tracking

Find New Suppliers & See New Technologies at the Region’s Largest Design & Contract Manufacturing Trade Show ‌  ‌  ‌  ‌  ‌  ‌  ‌

Read more: Announcing the Marlborough Show in September

San Jose, CA: Zero Defects International [ZDI] has announced their participation as an exhibitor at the annual PCB West Conference and Exhibition held again at the Santa Clara Convention Center in Silicon Valley.  Dates of the conference are September 11 - 13 and the one day exhibition will be Wednesday, September 12th.  

Read more: Zero Defects International to exhibit at PCB West 2018

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