Press Releases

Santa Clara, CA, August 9, 2018

Cirexx International announced today that they will be exhibiting at the AUVSI Pathfinder Symposium Von Braun Center in Huntsville, AL on August 22 – 24, 2018. Cirexx will be in Booth #21 demonstrating their complete product lines of advanced Printed Circuit Boards, including HDI and RF/Microwave and Flex Circuits, including Rigid-Flex. Applications engineers will be available at the booth to discuss the latest technology in these areas as well as Cirexx in-house design and component assembly services. Also, featured will be the company’s ECLIPS (Embedded Cooling Layer – Integrated Power System) technology. A system of producing high-power RF/microwave Printed Circuit Boards (PCBs) employing an embedded low-CTE, thermally engineered metalized heat-sink layer which has superior thermal conductivity characteristics.

Read more: Cirexx to Exhibit at AUVSI Pathfinder Symposium

Santa Clara, CA, August 6, 2018

Cirexx International has worked closely for several years with engineers at a major medical products manufacturer in the Midwest, to develop state-of-the-art Rigid-Flex Circuit Boards for use in cognition detection systems. The product is designed to be used by health providers to detect the human brains reaction to stimuli. It is used for early detection of Alzheimer’s and other neurological conditions. The cognition system is also used for clinical research and study.

Read more: Cirexx Supplies Rigid-Flex Circuits for Innovative Medical Application

Recently acquired by Hindley Circuits, Irridian Industrial Electronics, the electronic design services business is now located within our Cramlington manufacturing facilities.

Read more: Irridian Invests in New Printed Circuit Board Design Software Suites

Irvine California, USA – TopLine will exhibit its groundbreaking CCGA and PID component technologies at the upcoming NEPCON South China 2018 conference and exposition, at the Shenzhen Exhibition Center, August 28 – 30, in Stand #1F13. This marks the 6th straight year that TopLine has exhibited at this show; TopLine has been active in promoting its products in the China market for more than 20 years.

Read more: TopLine to Exhibit CCGA and PID Technologies at NEPCON South China 2018

August 8, 2018 – Ventec International Group Co., Ltd. (6672 TT), a world leader in the production of polyimide & high reliability epoxy laminates and prepregs, announced the appointment of George Janosko responsible for Technical Sales for the Mid-West region of the USA.

Read more: George Janosko joins Ventec International Group Technical Sales Team for Mid-West USA

Connected, “smart” wearables such as rings, bracelets, clothing and shoes are benefitting from tiny RF chip antennas that take up less PCB space and allow for more miniaturized devices.

Read more: Miniaturizing Smart Wearables for Fitness and Activity Tracking

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