May 31, 2018 – Ventec International Group Co., Ltd. (6672 TT), a world leader in the production of polyimide & high reliability epoxy laminates and prepregs, will showcase its latest PCB material technology innovations at the JPCA show, which is taking place at the Tokyo Big Sight East Hall from June 6-8 in Japan. The Ventec technology team will be on hand on booth #7B-32 showcasing unique laminate & prepreg capability solutions including the latest tec-speed 20.0 material – a Dk 3.48 ceramic-filled hydrocarbon thermoset material designed for high frequency applications.

Read more: Ventec Showcase Latest PCB Material Technology Innovations at JPCA, Japan

BERLIN, May 31, 2018: Atotech today announced that it will present its latest production solutions for the flex/ flex-rigid PCB market at the New Product Introduction (NPI) sessions at the JPCA 2018 show. The trade show will be held from June 6 to 8, 2018, at Tokyo Big Sight, East Exhibition Halls 4 to 8, in Tokyo, Japan. Next to its presentation, the company will also showcase new products from various other fields at booth 7A-16.  

Read more: Atotech to present its new product series for flex/ flex-rigid printed circuit board (PCB)...

Singapore: Eli Ikan, Fineline-Global’s General Manager has announced the appointment of Hughes Cain and Associates to handle his company’s sales effort the Southwest and Mexico.

Read more: Fineline-Global appoints Hughes Cain and Associates for Southwest Territory

BERLIN, May 29, 2018: Atotech today announced that it will partake in the IPC Automotive Electronics Reliability Forum with a presentation on “Dissipating Thermal Energy in PCBs - Solid Copper Through Via Filling”.

Read more: Dissipating Thermal Energy in PCBs – Atotech to participate in the IPC Automotive Electronics...