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  • Thermal Vias are Ineffective. Here’s Why.

    Thermal Vias are Ineffective. Here’s Why.

    Adding thermal vias can take up valuable board space with little benefit.
      READ MORE...

  • Connecting the Industry, from Boards to Assemblies

    Connecting the Industry, from Boards to Assemblies

    HDP is embarking on new rounds of evaluations of laminates and lead-free solders.
      READ MORE...

  • Exploring the Impact of AI

    Exploring the Impact of AI

    A special panel discusses the growth of AI tools and its possible effects on the industry.
      READ MORE...

  • A Journey in Rigid-Flex Design

    A Journey in Rigid-Flex Design

    Overcoming the challenges of rigid-flex designs can be incredibly rewarding.
      READ MORE...

  • Creating the Ultra Library

    Creating the Ultra Library

    Building and maintaining what's said to be the world's largest CAD database requires strong relationships.
      READ MORE...

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Press Releases

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Category: Press Releases

BANNOCKBURN, Ill., USA, January 30, 2018 — IPC -- Association Connecting Electronics Industries® announces the addition of Colette Buscemi as senior director of education programs to its staff at IPC headquarters in Bannockburn (Chicago), Ill.

Read more: IPC Welcomes New Senior Director of Education Programs

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Plainview, NY, USA – Technic Inc. is pleased to announce the appointment of Bruno Kiski as Senior R&D Engineer / Imaging Products.

Read more: Technic Inc. Appoints Bruno Kiski as Senior R&D Engineer / Imaging Products

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NESS ZIONA, Israel, January 29, 2018 - Nano Dimension Ltd., the world’s leading additive electronics provider (NASDAQ, TASE: NNDM), today announced that Nanyang Technological University, Singapore (NTU Singapore) has purchased the company’s DragonFly 2020 Pro 3D Printer for electronics development.

Read more: Nano Dimension DragonFly Pro 2020 3D Printer for Electronics Purchased by NTU Singapore

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WATERBURY, Conn, USA, January 25, 2018– MacDermid Enthone Electronics Solutions (MEES), a global electronics chemicals supplier, will exhibit at the IMAPS Device Packaging show being held in Fountain Hills, Arizona, March 6-7, 2017.

Read more: MacDermid Enthone Electronics Solutions to exhibit at the 2018 IMAPS Device Packaging Show

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PCB technology company Aspocomp Group Plc has been granted about EUR 1.3 million in development support from the European Regional Development Fund under the Leverage from the EU 2014-2020 program for investments in high-tech and capability development.

Read more: Aspocomp Receives EUR1.3 Million Fund as Development Support

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NESS ZIONA, Israel, January 17, 2018 - Nano Dimension Ltd., the world’s leading additive electronics provider (NASDAQ, TASE: NNDM), today announced that a leading research institute from Hong Kong has purchased the company’s DragonFly 2020 Pro 3D Printer.

Read more: Leading Research Institute in Hong Kong Purchases Nano Dimension DragonFly Pro 2020 3D Printer

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