The Tech Etch Board of Directors is pleased to announce that Richard Cammarano has been elected to serve as the next President/CEO of Tech-Etch, Inc. and will move into that position on June 18th 2018.

Address rapid reliability analysis with Nastran-Sherlock integration

Beltsville, MD – May 22, 2018 – DfR Solutions, the leader in quality, reliability, and durability (QRD) solutions for the electronics industry, today announced that it is presenting, Rapid and Accurate Reliability Analysis Through Nastran-Sherlock Integration, with Honeywell Aerospace at the Siemens PLM Connection - Americas June 4-7, 2018, in Phoenix, Arizona. Dr. Craig Hillman, CEO of DfR Solutions will be co-presenting with Randolph Hook, Staff Mechanical Engineer at Honeywell Aerospace on Wednesday, June 6 at 2:25 PM.

WHO:               Simon Fried, President of Nano Dimension USA, a leading additive electronics provider (Nasdaq, TASE: NNDM).

BANNOCKBURN, Ill., USA, May 21, 2018 — IPC's Validation Services Program has awarded Ventec International Group, a global electronics materials manufacturing company headquartered in Suzhou, China, a second IPC-4101 Qualified Products Listing (QPL). Ventec successfully qualified their products, VT-90H and VT-901, to specification sheet 40 of IPC-4101E, Specification for Base Materials for Rigid and Multilayer Printed Boards.