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    The Trade Show Connection

    Finding community amid chaos.  READ MORE...

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    Understanding ANOVA

    Analyzing process data for accurate, defensible decisions.  READ MORE...

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    High Yield Design Practices

    Building with manufacturing limits in mind.  READ MORE...

  • Rigid-Flex Design

    Rigid-Flex Design

    Rigid-flex technology is redefining electronics design.  READ MORE...

  • PCB Thermal Challenges

    PCB Thermal Challenges

    When passive heat management isn’t enough.  READ MORE...

  • NTI-100: The World’s Top PCB Fabricators

    NTI-100: The World’s Top PCB Fabricators

    The changing map of PCB production.  READ MORE...

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Press Releases

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Category: Press Releases

Haverhill, June, 2018. Presented for the first time in US during IPC Apex, it will also be shown at Semicon West booth 509, Pilot V8 Next> series, the most versatile and performing flying probe system in the world, which represent yet another outstanding technological leap forward in Seica’s continuous “road” to innovation.

Read more: Seica Inc. Participation at Semicon West

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Category: Press Releases

Deadline for technical conference paper abstracts extended to: June 29, 2018

Read more: IPC Extends Deadline on Call for Participation for IPC APEX EXPO 2019

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Category: Press Releases

Complete Range of Services Enables Aerospace Manufacturers to Prototype and Launch Advanced Products from One Location

Read more: Sanmina Achieves AS9100D Certification at its Costa Mesa Technology Center

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Category: Press Releases

Innovative solutions based on new materials, hybrid circuit board assemblies with various technologies and embedded circuits

Read more: AT & S provides connecting technology for next-generation mobile-5G

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Category: Press Releases

June 19, 2018 – Ventec International Group Co., Ltd. (6672 TT), a world leader in the production of polyimide & high reliability epoxy laminates and prepregs, is pleased to announce a USD300k investment for its Central European facility in Kirchheimbolanden, Germany.  The plan includes an upgrade to the clean-room environment, an additional Yowshi diamond blade saw and the installation of an aluminum coil cutting line.

Read more: Ventec Announces $300k Investment Plan for its German Service Center

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Category: Press Releases

BERLIN, June 15, 2018: Atotech is pleased to announce its participation in the EIPC Summer Conference 2018.  With two presentations, one in the Keynote Session on “Business, Technology and Trends” and one as part of the later “New Material/ Processes for PCB Manufacturing” session, Atotech will be well represented at this 50th anniversary conference. The EIPC Summer Conference 2018 will be held in Duesseldorf, Germany, from June 21 to 22, 2018.

Read more: Atotech to present “The changing shape of the HDI market” at the EIPC’s 50th anniversary conference

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