Printed Circuit Design & Fab Online Magazine - Current

Products

CR-5000 revision 13.0 design suite for electronics systems and printed circuit boards introduces new core technology for power integrity analysis along with an array of developments to accelerate process optimization and integration including more efficient DRC checking, improvements in hierarchical design, management of constraint data and more.

Read more: Zuken Releases CR-5000 v. 13

CFS conductive EMI foam shielding material improves quality and performance of die-cut enclosure gaskets. Is low pressure and manufactured in sheets that have a low-resistance polyester fabric surface and a resilient Nickel-Copper polyurethane foam center. Is for intricate die-cut finishing operations found in I/O panel, backplane and access panel applications. Gaskets offer a typical shielding effectiveness of 60dB between 10MHz-3GHz. Exhibits a compression load of 2.1 psi at 30% compression and has an operational temperature range from -40° to +156°F.

Leader Tech, www.leadertechinc.com

CR-5000 Lightning Power Integrity Advance is for concurrent analysis of power and DC noise effects and electromagnetic interference at any point during the physical design process. Reportedly shortens design time by eliminating iterations and rework.

Read more: Zuken Launches CR-5000 Lightning Power Integrity Advance Tool

PS1 and SSB connectors feature a tool-less latching system made of nickel-plated beryllium copper that automatically engages. PS1 typically is fixed to the printed circuit board using mounting screws. Leads are available in SMT and through-hole solder versions. SSB mates with PS1; is available with solder cups or color-coded wire. Easily attaches to the back of standard I/O connectors. Can have the I/O connector-to-SSB as a harness according to customer specs. Family uses flex-pin contact system. Gold-plated contacts are of the same quality as those used in MIL-DTL-83513 micro-D connectors. Are spaced at a 1.27 mm pitch. Micro connectors can carry up to 3 amps per contact; are available in pin counts from 2 to 48.

Omnetics International, www.omnetics.com

FloEFD is for concurrent computational fluid dynamics simulation. Is integrated into Siemens NX product lifecycle management software. Works directly with native NX geometry using finite volume mathematical techniques. Uses a hexahedral immersed boundary meshing approach. Can support a full range of physical simulation capabilities: turbulent flow fields, compressible flows, combustion and cavity modeling.

Mentor Graphics, www.mentor.com

SlimShield is a low-profile, two-piece board level shielding line with a dimpled cover that snaps into etched holes on the fence. Offers shield heights as low as to 0.060". Photo etching provides design freedom. Standard dimple tooling offers variable dimple location with excellent cover retention. An optional flange is available on larger fence designs. Multi-cavity designs are achieved by incorporating internal fences, enabling multiple components to be shielded with the same part. Mounting pins are offered in any configuration. A configurable PDF sales drawing can be downloaded from the website.

Tech-Etch, www.tech-etch.com