Indx v 4.1 library management software includes a completely redesigned user interface with significant performance and productivity increases across the entire design team user flow. Includes real-time status display, spreadsheet views that allow batch editing on the fly, quick search and edit, symbol and geometry previews, and complete commit history tracking with versioning. Major new features include all-in-one library manager; edit-in-place library structure; fully packaged parts = auto-packaging + auto-referencing on the fly during placement; 100% legacy data transition with Intercept translators; relational database structure for optimum performance.
Intercept Technology, www.intercept.com/library-management/library-management.html
Voratron electrical encapsulation uses epoxy, polyurethane and other chemistries to meet a wide voltage range for power transmission and distribution equipment. Is said to have excellent thermo-mechanical performance and electrical insulation, for electrical devices, circuitry, transformers, switchgears sensors, capacitors, relays, coils, insulators and components.
Dow Formulated Systems, www.voratron.com
NestLib 2010 R3 includes a new module for PCB fabrication. Is a nesting technology focused on optimizing 2D packaging. Provides high-speed algorithms for fully automated True Shape nesting. Consists of a base module and a set of optional advanced modules. Is available as a static library, dynamic linked library, and COM DLL. Supports Java and .NET. Is available for 32 -bit and 64-bit Microsoft Windows OS, as well as for Sun Solaris and Linux platforms. Can be ported to Mac OS on demand. Supports multi-core computing for dual core and quad core computers.
Geometric, www.geometricglobal.com
ACE Translator 3000 version 6 provides over 100 translators between most common EDA, CAD, and 3D formats, all in a single intuitive environment. Is said to simplify translation process. Built-in viewer is user-friendly with powerful editing and repair features. Outputted files optimized for compatibility with all design systems. Supports AutoCAD 2010 and AutoCAD 2011 DWG/DXF files. Export (Gerber, DXF, ODB++) will automatically detect Arcs. Can flash all selected objects at once to a chosen shape.
Numerical Innovations, www.numericalinnovations.com
CST Studio Suite 2011, including CST Microwave Studio high-frequency simulation software, is for electromagnetic problems. Material property descriptions have been enhanced across available solvers. High-performance computing options are available for the frequency domain and the integral equation solver. Time and frequency domain can provide sensitivity information for an arbitrary number of parameters in one simulation run. The trust region framework can employ sensitivity information. Yield analysis for complex 3D models is available at virtually no additional computational cost. The multiphysics flow has been enhanced. Based on one simulation model, the simulation task concept makes optimization feasible, considering electromagnetic, thermal and mechanical aspect. Temperature calculated from the electromagnetic losses can be used to change the material parameters for a consecutive electromagnetic field simulation. CST Mphysics Studio also features a thermal solver on tetrahedral grids.
Computer Simulation Technology, www.cst.com
QUICKCross v.15.0 software cross-references more than 517,000 industry part numbers, including thousands of new parts such as clips and test leads and terminals and connectors. Search result formats have been updated to include PDFs of catalog information on all NTE and ECG product lines. Permits quick searches for products and availability, and links directly to product datasheet PDFs.
NTE Electronics, http://nte01.nteinc.com/webforms.nsf/qcsignin?openform