Craneboard is an ARM-based development board that offers open source PCB and design. Uses Beagleboard support and resources. Is based on TI's AM35x Sitara ARM Cortex-A8 MPU; features include PoE and CAN bus interfaces. Offers numerous integrated peripherals and provides power-over-DC wall adapter, PoE enabled by TI's TPS23750 PoE controller and USB, which permits portability. Expansion port permits adding functionality such as an LCD panel, along with wireless and audio capabilities, and is compatible with other ARM Cortex-A8 open source boards.
Mistral Solutions, www.mistralsolutions.com
RT/duroid 6035HTC high-thermal-conductivity laminate is for low loss in high-power circuits. Fluoropolymer composite material is for RF and microwave applications. Features relative Dk of 3.5 at 10 GHz, thermal conductivity of 1.44 W/mK and loss tangent of 0.0013 at 10 GHz. Is said to have superior heat-transfer characteristics. Fabricated with thermally stable, reverse-treated and electrodeposited copper foils. Supports clean drill holes with minimal tool wear. Available in a variety of dielectric thicknesses and cladding options.
Rogers Corp., www.rogerscorp.com
Eagle v. 5.11 CAD incorporates new functionality for automatic search and online pricing and availability. Setup and save options now available for individual order lists for schematics, and lists can be added to a shopping cart. Manufacturer libraries are now supplied with order codes. Has three main elements: schematic, layout and autorouter.
CadSoft Computer, www.premierfarnell.com
ECP SiP embedded component packaging technology enables system-in-package devices. Is for integrating active and passive components into PCBs. Used in products that need to fit the largest possible number of features into the smallest possible space.
AT&S, www.ats.net
Four-ply, peel-n-stick FPDSEM 90 cooling patch reduces chip and circuit temperature by as much as 11% without the need for a heatsink. Thermal material radiates heat from an electronic component to the surrounding environment. Apply patch like a sticker to the surface of any hot spot. Can be custom cut or trimmed to fit virtually any shape. Provides a thermal conductivity of 1.5 W/m°K and a thermal emissivity of 0.97. Is 25 mm thick and can be ordered in sheets, rolls or kiss-cut rolls.
Fujipoly America Corp., www.fujipoly.com
Advanced Sweller process chemistry has a wide operational window. Handles normal and high performance laminates, using sustainable solvent and low operating concentrations.
Dow Electronic Materials, www.dow.com