Printed Circuit Design & Fab Online Magazine - Current

Products

MULINO, OR -- Printed circuit board prototype manufacturer Sunstone Circuits has added SMT stencils to its product line.

Read more: Sunstone Adds Stencils to Product Line

STMicroelectronics and Microchip Technology component libraries come with complete schematic symbols and printed circuit board footprints.

Read more: RS Components Offers STM, Microchip Parts Libraries

E³.series electrical CAD software suite for engineering, design, documentation and manufacturing wiring harnesses, cable assemblies and other electrical gear performs first phase electrical planning in the same software environment as schematic, harness, fluid and panel design.

Read more: Zuken Upgrades E³.series ECAD Suite

ICD Stackup Planner - HDI Designer Edition impedance calculator/stackup planner includes multiple differential pair definitions per layer.

Read more: ICD Releases ICD Stackup Planner - HDI Designer Edition

Studio Suite v. 2011 SP5 offers transient bidirectional co-simulation between cable currents and electromagnetic fields in the surrounding space.

Read more: CST Offers Studio Suite v. 2011 SP5 Transient Bidirectional Co-Simulation

The QFN package design kit for Agilent’s Advanced Design System electronic design automation software is based on MicroLeadFrame packages. Enables mutual Amkor and Agilent customers to improve RFIC/MMIC design quality and time-to-market. Can explore various design specifications with package information and implement optimized RFIC/MMIC designs. Contains models for 3 x 3, 4 x 4, 5 x 5, and 6 x 6 MLF QFNs. All die are scalable; material properties can be modified. Includes scalable models for bond pad arrays and board via arrays.

Amkor, www.amkor.com