Multi-cavity board-level shielding permits isolation of individual components on the same board with minimal weight and footprint allocations. Offers up to 60 dB of shielding effectiveness; shields are installed using through-hole or surface mount soldering. Two-piece fence and removable cover construction facilitates rework and inspection.

Leader Tech, www.leadertechinc.com

CAM350 version 10.5, for verification and optimization of printed circuit boards, features DesignAnalyzer, a new method to analyze contents and complexity of a PCB design against the capabilities of the PCB fabricator. Analyzes overall complexity of the design for quoting purposes or for deciding which fabricator is qualified to manufacture it.

Read more: DownStream Announces CAM350 v. 10.5

Thermex is a thin sensor film that can be used in virtually any application to test and monitor heated contacting surfaces from 200° to 300°F. Can be used alone or in conjunction with Fuji Prescale pressure indicating film. When exposed to heat, it changes color instantly and permanently to reveal temperature distribution between any two contacting surfaces. Intensity of color change directly relates to temperature it was exposed to; reveals spot high or low temperature zones and minute surface variations. Applications include heat sealing, lamination/press, flat web-type machines used in converting, ultrasonic welding, heat sinking, and clutch/brake interfaces.

Sensor Products Inc., www.sensorprod.com

Advanced Design System 2011 Momentum solves power integrity problems complicated by heavily perforated power and ground planes. Contains full wave 3-D multilayer electromagnetic field solver that yields power distribution network impedance for an arbitrary input mixture of power, ground and signal nets on each layer. Results said to be valid into the multi-gigahertz range. Can be applied to heavily perforated printed circuit boards and high-frequency IC package power integrity problems. Includes a signal integrity/power integrity analyzer that provides a simple net-based electromagnetic simulation setup wizard and automatic test-bench generator for typical SI/PI circuit simulations. Models wire bonds, the effects of frequency-dependent dielectric loss and the surface roughness of copper traces.

Agilent Technologies, www.agilent.com/find/ADS_PI_images