Advanced SAP Metallization semi-additive process chemistry includes neutralizer, conditioner and electroless copper. Provides high dielectric adhesion with low roughness, plating coverage on both via bottom and surface, excellent bath stability and reliability performance for ultra fine lines.

Dow Electronic Materials, www.dow.com

Thick Panel Copper Plating, for electrolytic plating, enhances throwing power for very thick (over 3.2 mm thickness) panel plating. High Speed Direct Current Copper Plating improves throwing power at increased plating densities on high aspect ratio and microvia boards. Are said to increase plating efficiency and obtain higher productivity without the need for extra equipment.

Dow Electronics Materials, www.dow.com

Silveron MF 100 autocatalytic silver with immersion gold is a replacement for immersion silver and ENEPIG (electroless nickel electroless palladium immersion gold). Has a dense silver coating to prevent diffusion of copper to the silver surface and reduce copper oxide formation. Provides solderability and gold wire bondability.

Dow Electronics Materials, www.dow.com

Aurolectroless SMT 520 ImAu finish reportedly permits operation at low gold salt concentrations to reduce gold consumption in ENIG processes. Is said to provides deposit coverage to increase corrosion resistance during subsequent process steps.

Dow Electronics Materials, www.dow.com