FAB 3000 v.5 CAM software runs DRC/DfM verification, edits and outputs Gerber data, compares nets, merges PCBs, and generates part centroid files.
DART technology is used in conjunction with CAD/CAE support services. Increases accuracy and speed of migration, conversion and translation initiatives. Migrates legacy data to new EDA technology platforms. Reduces manual verification processes.
AcAe, www.acae.com
FloTHERM 3D computational fluid dynamics software identifies where heat flow congestion occurs in the electronic design and why, and identifies thermal shortcuts.
EMI/RFI Testing Survival Kit investigates and tests EMI/RFI shielding materials. Includes magnetic field probe; electric field probe; EMI/RFI demo fixture; materials samples, and cables and probes. Sample materials include nickel on copper-plated polyester fabric tape with conductive adhesive; embossed foil tape; aluminum foil tape with conductive adhesive; tin-plated copper foil tape with conductive adhesive; EMI absorber materials; EMI gasket material, and polyester laminated aluminum foil tape with conductive adhesive. Also includes samples of die-cut materials.
Fabrico, www.fabrico.com
MultiClad HF halogen-free, low-loss thermoset laminate and prepreg system is for microwave and high-frequency printed circuit boards.
Sphinx advanced analysis kits for printed circuit board signal integrity simulation include a 2+ hr. video seminar on designing for signal and power integrity covering the basics of SI/PI integrity, interaction between signal and power, identifying return path discontinuities, advanced concepts and a reliable methodology for reaching fast and accurate design closure; a copy of “Power Integrity Modeling and Design for Semiconductors and Systems”; applications videos to help resolve problems commonly found in today’s designs; a 30-day evaluation license of Sphinx or Sphinx for Signoff.
E-System Design, www.e-systemdesign.com