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  • Tolerances and Dimensions for PCB Fabrication

    Tolerances and Dimensions for PCB Fabrication

    The tolerances decide what actually ships.  READ MORE...

  • How to Avoid 'Ghost Manufacturing'

    How to Avoid 'Ghost Manufacturing'

    Hidden subcontracting can expose providers to latent quality risks.  READ MORE...

  • Flex Circuits for Use in Catheters

    Flex Circuits for Use in Catheters

    Long, narrow flex circuits push manufacturing limits.  READ MORE...

  • A Guide to Flexible and Rigid-flex PCBs.

    A Guide to Flexible and Rigid-flex PCBs.

    What is a flex PCB?  READ MORE...

  • UHDI Solder Mask Considerations

    UHDI Solder Mask Considerations

    Can solder mask tolerance follow UHDI's lead?  READ MORE...

Homepage Slideshow

  • Tolerances and Dimensions for PCB Fabrication

    The tolerances decide what actually ships.

    https://pcdandf.com/pcdesign/index.php/current-issue/241-designer-s-notebook/19202-tolerances-and-dimensions-for-pcb-fabrication

  • How to Avoid 'Ghost Manufacturing'

    Hidden subcontracting can expose providers to latent quality risks.

    https://pcdandf.com/pcdesign/index.php/current-issue/270-board-buying/19199-the-phantom-menace-of-pcb-purchasing-how-to-avoid-ghost-manufacturing

  • Flex Circuits for Use in Catheters

    Long, narrow flex circuits push manufacturing limits.

    https://pcdandf.com/pcdesign/index.php/current-issue/243-flexperts/19205-flex-circuits-for-use-in-catheters

  • A Guide to Flexible and Rigid-flex PCBs.

    What is a flex PCB?

    https://pcdandf.com/pcdesign/index.php/editorial/menu-features/19208-a-guide-to-flexible-and-rigid-flex-printed-circuit-boards

  • UHDI Solder Mask Considerations

    Can solder mask tolerance follow UHDI's lead?

    https://pcdandf.com/pcdesign/index.php/editorial/menu-features/19210-uhdi-solder-mask-considerations

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  • FKN Systek Rolls Out S100 Depaneling Saw

Chemplate Rolls Out Indubond 130N Bonding Machine

Published: 18 November 2011

Indubond 130N  inductive bonding machine is said to facilitate pin registration for printed circuit board innerlayers. Elastic bonding points withstand movements of innerlayers during hot press cycle. Is said to eliminate internal tensions, thereby reducing warping.

Chemplate Materials, www.chemplate.com

 

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