Printed Circuit Design & Fab Online Magazine - Current

Products

Pantheon PCB/Hybrid/RF layout design application enhancements provide benchmark design performance increases of up to 75x. Performance increases are notable in designs using block technology, which provides opportunities to shorten design cycle times and reduce repetitive edits by allowing full or partial board circuitry to be defined as a block and placed one or more times into another block, board, or panel. Supports placement of sub-blocks within main blocks; maintains connectivity with the schematic at all levels of board hierarchy, while permitting edits and automatic updates.

Intercept Technology, www.intercept.com

CST Microwave Studio version 2011 SP3 has finite element-based eigenmode solver, alongside finite integration technique-based eigenmode solver. Features curved elements of arbitrary order; elements enable conformal representation of geometry that provides simulation accuracy. Includes high-performance computing options. Transient solver now supports NVIDIA Tesla 2o series. MPI-based parallelization is available for integral equation solver with MLFMM.

Computer Simulation Technology, www.cst.com

MaxVIA plasma treatment system treats a variety of panel sizes and types. Provides high throughput and plasma uniformity in desmear and etchback applications for high density interconnect, flexible, and rigid circuit board manufacturing. Offers expanded plasma chamber to accommodate large panel sizes of up to 24 x 42"; has a throughput capacity of 92 to 138 units per hr., depending on panel size. Uses 75% less volume of CF4 gas than other systems for desmear applications.

Nordson March, www.nordsonmarch.com

SinkPAD aluminum printed circuit board technology reportedly improves LED thermal management. Is effective in high-power LED cooling. Conducts heat from the LED by enabling a direct thermal path between the LED and surrounding atmosphere. LED thermal resistance can be reduced by eliminating the lowest thermal conductivity/highest thermal resistance component, the dielectric material. Dielectric material functions only as an electrically insulated barrier to the metal base, but leaves it thermally connected.

SinkPAD, www.sinkpad.com

SystemSI signal integrity analysis software is for end-to-end simulations of high-speed signal interfaces. Has block-based editor, support for standard modeling formats, automated model connections and accurate simulation. Can be used at the pre-layout stage, post-layout stage, or anywhere in between. TLine Editor and Via Wizard are available. Model connections are automated with open Model Connection Protocol format. Is available in SystemSI – Serial Link Analysis and SystemSI – Parallel Bus Analysis. The latter builds on capabilities introduced in Channel Designer software to analyze high-speed SerDes designs. Parallel Bus Analysis brings the same level of automation and accuracy to the design of high-speed bus interfaces such as DDRx memory interfaces; enables quick analysis of timing margins for DDRx memory interfaces; considers multiple effects concurrently, including dielectric/conductor loss, reflections, crosstalk, inter-symbol interference and simultaneous switching noise.

Sigrity, www.sigrity.com

GenClad 280 bond-ply is a woven fiberglass-reinforced, ceramic-filled composite material for multilayer RF and high-frequency printed circuit boards. Combines a non-polar thermoset resin system with controlled-expansion ceramic filler and a low-loss thermoplastic material. Is engineered for use in bonding dissimilar and hard-to-bond materials in multilayer PCB structures, particularly in high-speed and microwave applications. Is compatible with PTFE laminate materials; prepreg processes in conventional FR-4 lamination cycles. Has a low dielectric constant and loss (2.8/0.002 at 10 GHz); low water absorption (0.04%); stable dielectric constant over frequency and temperature; excellent adhesion to a variety of PTFE and other RF/microwave cores; high decomposition temperature (443°C) and T288 (>60 sec) for Pb-free solder compatibility; low Z-direction CTE (45-50 ppm/°C) for enhanced PTH reliability, and is RoHS compliant.

Arlon Material for Electronics, www.arlon-med.com