N7000-3 polyimide laminate material complements N7000-3 prepreg. Has a UL 94V-1 designation, with no visible bromine. Is a high-Tg polyimide using toughened resin chemistry. For use in applications that require fine geometry, multilayer construction or extreme reliability.

Park Electrochemical Corp., www.parkelectro.com

LDI 5s Series pushes resolution below 10 µm, for IC packaging production and other fine feature products. Features rotor-based projection system for smooth, continuous scanning, proprietary spatial light modulation, twin-table stage, high bandwidth datapath for improved alignment overlay on individual panels in real time, unique autofocus, and more.

Micronic Mydata AB, www.micronic-mydata.com

RTL Power Model is designed to optimize a wide range of power-sensitive applications, such as ultra-low-power electronics. Predicts integrated circuit power behavior at the RTL level with consideration for how the design is physically implemented; helps enable chip power delivery network and IC package design decisions early in the design process; ensures chip power integrity sign-off for sub-28nm ICs.

Apache Design Inc., www.apache-da.com

Cadstar version 13.0 printed circuit board design software now has improved letter drill drawing creation; improved DXF import; improved routing, and an IDF interface.