F05 Poly-forms are an alternative to liquid adhesives for component assembly. Are flexible pre-shaped adhesives designed for bonding metals, plastics, and glass. Have negligible vertical flow; keep adhesive contained in precisely defined areas. Pre-shaped copolymer prevents drips and dispensing inconsistencies typical of liquid adhesives. Adhesive placement is consistent from bond to bond. Facilitates manual and automated handling. Can be pre-shaped in multiform configurations to accommodate a broad range of applications. Temperature and time required to process depend on component materials, design, bond requirements, and operating environment. Adding pressure and increasing oven temperature and time improves adhesion. Min. processing temperature is 107°C. Typical processing schedule is 135°C for 10 min. under 5 psi.

Multi-Seals, www.multi-seals.com

Tac-LED-3D is an IMS substrate based on ceramic-filled fluorpolymer thermoplastic resin chemistry. Has ultra-thin, nonbrittle dielectric (0.085mm) and high copper peel strength; is SMT compatible; 3D structures can be formed after SMT assembly; has high thermal conductivity and high resistance to thermal aging. Applications include LED lighting and high-power LED PCBs. Is robust with adhesion to metal layers. Melt temperature is in excess of 300℃. Aluminium and copper backings are available.

Taconic, www.taconic-add.com 

MDO4000 series oscilloscope has a built-in spectrum analyzer. Can capture time-correlated analog, digital and RF signals simultaneously. A single instrument correlates events in the frequency domain with the time domain phenomena that caused them. Provides system-level debugging of wireless-enabled designs; can be used for timing analysis for mixed domain designs and tracking the source of noise or interference.

Tektronix, www.tek.com

E-cleanDF is an acid equipment cleaner designed for use with photoresist developers and strippers. Designed with Asian manufacturing methods in mind. Is particularly effective on dry film resists, antifoam residues, hard water scale, and carbonate residues. Removes residues inside nozzles and pipes. Cleans equipment in one hr. May be used at room temperature, without heating; may be reused three or more times, depending on the condition of the equipment being cleaned.

RBP Chemical Technology, www.rbpchemical.com