Products

EMPro 2011.11 3D modeling and simulation platform, for creating 3D models and analyze electrical performance of packages, connectors, antennas and other RF components, introduces key improvements to the FEM simulator:

Read more: Agilent Upgrades EMPro 2011 to v.11

ADS 2011.10 electronic design automation software for RF, microwave and signal integrity applications, now features a design documentation notebook for creating and sharing all or selected views of schematics, layout and data displays, and generate PDF and PostScript outputs files;

Read more: Agilent Releases ADS 2011 v. 11 RF Tools

ProtoLaser U3 structures circuit layouts directly on laminated materials such as FR-4. Displays high beam quality as a UV laser system and can geometrically structure conductors with a 100µm pitch, based on 70µm/30µm lines/spaces. Combines functions of ProtoLasers S and U for finer processing.

LPKF, www.lpkf.com

Cadstar Placement Planner helps communicate intent and provide guidance to the PCB designer.

Read more: Zuken Releases Cadstar Placement Planner

NI USRP-2920 and NI USRP-2921 instruments offer an educational platform that delivers a hands-on learning experience with real-world signals to RF and communications university labs. Consists of universal software radio peripheral hardware, NI LabVIEW software, and lab-ready course material; exposes students to practical application of abstract mathematical theories. USRP devices feature a software-tunable frontend ranging from 50 MHz to 2.2 GHz or 2.4 GHz and 5 GHz ISM bands. Hardware integrates a software reconfigurable RF transceiver with high-speed A/D and D/A converters; can stream baseband I and Q signals to a host PC over Gigibit Ethernet at up to 20 MS/s for real-time access to the spectrum.

National Instruments, www.ni.com/usrp

Sarcon 50G-Hm is a high-performance, low-resistance gap filler pad manufactured with a low-tac top surface. The one-sided treatment is reportedly less sticky than the opposing surface; thermal pad adheres to target electrical component or opposing heat sink. Provides removal without ripping, warping or damaging the interface material. Transfers heat with a thermal conductivity of 6.0 W/m°K and a low thermal resistance of .16°Cin2/W at 72.5 PSI.  This 0.5mm-thick, flame-retardant TIM is available in sheets up to 300mm x 200mm.

Fujipoly America Corp., www.fujipoly.com

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