Impact 100-Ohm orthogonal direct connector system is designed for a direct connection of printed circuit boards using the same daughtercard. Features options 3- through 6-pair; supports high-speed 25 Gbps data rates. Reportedly eliminates airflow, cross-talk, and capacitance constraints in high-speed channels introduced through current backplane/midplane laminates. Features two compliant-pin attach options and 18 to 72 differential pairs per orthogonal node. Leverages mating interface and compliant-pin technology. Features shorter line cards and switch-module signal paths. Has 2.15mm x 1.35mm grid on both the backplane and daughtercard.

Molex Inc., www.molex.com

IDF-TO-3D is a free Web-based software application. Creates detailed 3D printed circuit boards in fewer than two hours without MCAD software. After uploading IDF files, users can select replacement 3D models for each footprint contained within the IDF files from the integrated 3D library of 2,000+ footprint packages. Can view 3D board designs in 3D PDF format. Can purchase 3D PCBs in STEP format and integrate them into MCAD designs. Custom content can also be integrated into a personal user library. Can upload additional 3D component geometry in STEP format for integration into 3D PCB designs.

Simplified Solutions, www.simplifiedsolutionsinc.com

N4800-20 and N4800-20 SI are high-speed digital electronic materials available in prepreg and laminate forms. Are thermally robust with enhanced electrical properties. Are designed for use in sequential lamination and high layer count printed circuit board designs. Are CAF resistant, high Tg materials with low Z-axis expansion. Are compatible with Pb-free assembly processing. Have UL 94V-0 designations, meet IPC-101/29 specifications, and are RoHS compliant. N4800-20 SI is designed for high-frequency and low-loss applications that require enhanced signal integrity performance.

Park Electrochemical Corp., www.parkelectro.com

Capital Harness MPMT software application models harness designs against production capabilities to create structured bill-of-materials data. Is used to drive enterprise resource management systems. Helps identify what, where and how harnesses and their constituent sub-assemblies should be built. Identifies sub-assemblies common across different harness designs. Is part of Capital tool suite, an electrical system and wire harness design environment for the automotive, aerospace and defense industries.

Mentor Graphics, www.mentor.com