FootprintGen app is said to accurately automate generation of complex PCB footprint (land pattern) models in less time than manual methods.

Supports user-defined and IPC-7351 standard settings across a range of component families. Uses a process driven by rules, settings and component dimensioning forms. Supports BGA, chip, array, DIP, LCC, LGA, PLCC, QFN, QFP, SOJ, and SOP families. Supports multiple user settings with user-configurable line and text widths for solder mask, assembly, pad, and other layers. D-shape, oblong or rectangular pad shapes available, as are custom pad shapes with rounding or chamfering specifications. Pad stacks are user-configurable and can be assigned to unique locations including corner pads or specific row/column positions. Integrates seamlessly with OrCAD and Allegro PCB. Footprint models can be verified and correlated to schematic symbol models to identify errors or discrepancies.

EMA Design Automation, www.ema-eda.com/orcadapps

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