IntelliTool electroplating tooling concept is said to improve uniformity and deposition speed of copper electrodeposition on printed circuit boards. Includes a controllable matrix of inert anode rods, at a short distance of the substrate. Consists of an anode holder positioned inside the electrolyte on which the anode rods are mounted. A feeding network (outside of the electrolyte), consisting of a DC power supply and USB interface, controls and imposes required current on each anode segment. Simulation software optimizes current on each anode segment in time to yield the desired (uniform) deposition over the substrate. Take cell design, substrate pattern and resistivity into account. Performs simulations offline.

Elsyca, www.elsyca.com

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