Studio Suite v. 2011 SP5 offers transient bidirectional co-simulation between cable currents and electromagnetic fields in the surrounding space.

Read more: CST Offers Studio Suite v. 2011 SP5 Transient Bidirectional Co-Simulation

The QFN package design kit for Agilent’s Advanced Design System electronic design automation software is based on MicroLeadFrame packages. Enables mutual Amkor and Agilent customers to improve RFIC/MMIC design quality and time-to-market. Can explore various design specifications with package information and implement optimized RFIC/MMIC designs. Contains models for 3 x 3, 4 x 4, 5 x 5, and 6 x 6 MLF QFNs. All die are scalable; material properties can be modified. Includes scalable models for bond pad arrays and board via arrays.

Amkor, www.amkor.com

Technistan HTM 4089 is a high throw matte tin sulfate process for printed circuit boards. Additive suppresses deposit thickness on the surface, creating a thicker deposit in the center of a high aspect ratio through-hole or at the bottom of a blind microvia with a fine grain deposit. Provides resistance to final etchants. All components are analyzable and stable. 

Technic, www.technic.com

Engenix v. 3.3.0 engineering automation software for printed circuit board manufacturing is for stackup and traveler automation, job management, communication and collaboration. Integrates CAM, shop floor, and business data. Includes features that center on improving the requirements of rigid-flex circuits, including a stackup editor permitting users to define the final customer product and the manufacturing details required for rigid-flex PCBs; unlimited flex-connector and secondary rigid sections can be added to accommodate complex designs; impedance calculations automatically take into account material changes in the flex sections for transmission lines originating the primary rigid section; optional 3-D graphics are available.

Cimnet, http://cimnet-systems.consona.com/