UniCam FX 9.1 and Test Expert 9.1 manage and control delivery of product data to the shop floor, and prepare and optimize product data for manufacturing and test processes. Are said to be easy-to-use, for small batch, high-mix environments that require rapid development and support of many programs for printed circuit board (PCB) manufacturing equipment. Feature faster, easier, offline programming capabilities, merge computer-aided design (CAD) and bill-of-materials (BoM) data with support for more than 65 CAD data formats; process designs by simulating the factory in order to select and validate best manufacturing strategies; and configure lines, operations and define workflows for machine programming and optimization, such that they are achieving an optimized and balanced surface-mount technology (SMT), through-hole technology (THT) and manual assembly line setup. New machine interfaces said to offer seamless connectivity and support for Siplace, Assembléon, Mydata, Fuji and other equipment. Enhancements to the testability and fixture design rules in Test Expert ensure appropriate test coverage is available, and can provide valuable feedback to design prior to the PCB being manufactured.

Siemens PLM, www.plm.automation.siemens.com/en_us/

Flexible EL system is formed on polyester films. Each EL sheet layer, excluding the ITO layer, is produced using an advanced screen printing process. Layers are less than 15 µm thick and are flexible because of organic binder materials. Total sheet thickness can be as little as 100 µm. Come in blue, pink and yellow. Produces flexible light sources and signage.

DKN Research, www.dknresearch.com

AlphaSTAR 420R prevents creep and flaking corrosion seen in harsh PWB service environments. Is used as a final post-treatment step in the AlphaSTAR PWB immersion silver process. Is formulated to enhance corrosion resistance and deliver a tarnish-free surface. Is water-soluble. Penetrates micropores.

Enthone Inc., www.enthone.com

XT/duroid thermoplastic laminate materials are for high-frequency multilayer circuits. Feature thin halogen-free dielectrics and come with low-profile copper foil cladding bonded directly to the dielectric without the use of adhesives, for low insertion loss. Are flame-retardant and thermally and chemically robust with high melting points and low outgassing. Feature a z-axis Dk of 3.23 ±0.05 at 10 GHz and a dissipation factor of 0.0035 or less at 10 GHz. Thermal coefficient of dielectric constant (TCK) is +7 ppm/°C from -50° to +150°C. They also exhibit excellent thermal conductivity of 0.35 W/m/°K. Estimated maximum operating temperature exceeds 210°C. Are compatible with lead-free-solder assembly methods.

Rogers, www.rogerscorp.com