Syron 7000 and 7100 thermoplastic laminates are said to have higher melt temperature than PTFE. Have estimated UL relative thermal index of greater than 210°C. Are flame-retardant, halogen-free and compatible with Pb-free solder processes. Resistant to solvents and reagents commonly used in printed circuit board processing; can operate in harsh chemical environments. Are suitable for flex-to-install applications, lightweight feed manifolds, automotive sensors, and in electronics for oil and gas exploration. Are available with 0.5 oz. low-profile electrodeposited copper foil cladding and in panel sizes that include 12" x 18" and 24" x 18". Feature dielectric thickness of 0.002" with thickness tolerance of ± 12.5%. Have max. z-axis Dk of 3.4 at 10 GHz, with max. z-axis dissipation factor of 0.0045 at 10 GHz. Offered with dielectric thicknesses of 0.002" and 0.004"; tolerance of ± 12.5%.
Rogers Corp., www.rogerscorp.com
Multi-cavity board-level shielding permits isolation of individual components on the same board with minimal weight and footprint allocations. Offers up to 60 dB of shielding effectiveness; shields are installed using through-hole or surface mount soldering. Two-piece fence and removable cover construction facilitates rework and inspection.
Leader Tech, www.leadertechinc.com
CAM350 version 10.5, for verification and optimization of printed circuit boards, features DesignAnalyzer, a new method to analyze contents and complexity of a PCB design against the capabilities of the PCB fabricator. Analyzes overall complexity of the design for quoting purposes or for deciding which fabricator is qualified to manufacture it.
Read more: DownStream Announces CAM350 v. 10.5
Thermex is a thin sensor film that can be used in virtually any application to test and monitor heated contacting surfaces from 200° to 300°F. Can be used alone or in conjunction with Fuji Prescale pressure indicating film. When exposed to heat, it changes color instantly and permanently to reveal temperature distribution between any two contacting surfaces. Intensity of color change directly relates to temperature it was exposed to; reveals spot high or low temperature zones and minute surface variations. Applications include heat sealing, lamination/press, flat web-type machines used in converting, ultrasonic welding, heat sinking, and clutch/brake interfaces.
Sensor Products Inc., www.sensorprod.com
Advanced Design System 2011 Momentum solves power integrity problems complicated by heavily perforated power and ground planes. Contains full wave 3-D multilayer electromagnetic field solver that yields power distribution network impedance for an arbitrary input mixture of power, ground and signal nets on each layer. Results said to be valid into the multi-gigahertz range. Can be applied to heavily perforated printed circuit boards and high-frequency IC package power integrity problems. Includes a signal integrity/power integrity analyzer that provides a simple net-based electromagnetic simulation setup wizard and automatic test-bench generator for typical SI/PI circuit simulations. Models wire bonds, the effects of frequency-dependent dielectric loss and the surface roughness of copper traces.
Agilent Technologies, www.agilent.com/find/ADS_PI_images
Sphinx DC simulator provides DC analysis for IC package and PCB designs. Is based on multilayer finite difference methodology; enables quick identification of problem areas in designs. Can import designs, edit them, prepare them for simulation, and run frequency and DC analysis in parallel on one database. Ensures design has suitable DC levels available at voltage and ground terminals; has DC voltage levels that do not cause premature reliability issues; can be simulated in DC system level simulation by providing a condensed Spice circuit; avoids unexpected Joule heating effects; avoids signal voltage drops that cause receiver latching failures.
E-System Design, www.e-systemdesign.com