2015 Magazine Archives

• View the Digital Edition

FEATURES

THERMAL MANAGEMENT
How Hot Is My Via? (Cooler Than You Think!)
Simulations of via thermal excursions make clear designers have been overestimating what the size of a conductor must be to handle a given current. In fact, most designers don’t have any idea how hot a via gets. But it is not the current that determines the via temperature. Rather, the via temperature is determined (generally) by the conductor temperature.
by Douglas G. Brooks, Ph.D. and Johannes Adam, Ph.D.

DfM
Refining Lean NPI at Optimum Design Associates
The third phase of a multi-year study of the implementation of Lean NPI at a small-tier EMS reveals that moving DfM earlier in the process catches errors sooner than ever before, allowing them to be quickly and inexpensively rectified.
by Randy Holt

FIRST PERSON

• CAVEAT LECTOR
  Standard procedures.
  Mike Buetow

MONEY MATTERS

• ROI
  In PCBs and in life, tolerance is a virtue.
  Peter Bigelow
  

• FOCUS ON BUSINESS
  Getting to the root of STEM.
  Susan Mucha

TECH TALK

• ON THE FOREFRONT
  Where will package innovation go next?
  E. Jan Vardaman
• DESIGNER’S NOTEBOOK
  A BoM that’s okay to talk about.
  Chris Denney
• THE FLEXPERTS
  Impaneled for panel help.
  Mark Finstad
• TECH TIPS
  Handle with care.
  Tim O’Neill and Karl Seelig
• GETTING LEAN
  Lean test strategies.
  Michael Ford

• Prev
• Next