Solving ECAD/MCAD Co-Design
New generation ECAD systems address multi-board and native 3D design capabilities, along with direct translation to leading mechanical computer-aided design systems, enabling complete packaging and electronics assembly information to be transmitted between different disciplines in a fraction of the time required in the past.
by Humair Mandavia
How and Why to Use the IPC-9641 Standard
IPC-9641, High Temperature Printed Board Flatness Guideline, is the first standard to address local area PCB warpage across reflow profile temperatures. The standard is both educational about the general topic of PCB warpage measurement and specific in its guidelines for how such measurement should be done. A summary of the contents of IPC-9641, plus notes about how to implement it.
by Ken Chiavone