MCAD-ECAD Integrating PCB Layout and Mechanical Design The integration of PCB layout with mechanical design is a tough problem to solve. Not only does the shared information have to bridge the 2D to 3D gap, the amount and type of information that need to be shared varies from design to design and company to company. The longtime preferred format, IDF, represents only "snapshots" of the design and does not support incremental changes. However, a new data format, known as IDX, provides a new level of collaboration between board layout and mechanical design. by David Kehmeier
Careers PCB Designers, Rev. 2 Has anyone seen the next generation of PCB designers? The window to identify and train them is closing. What we can do about it. by Mike Creeden and Jeff Kuester
FIRST PERSON
Caveat Lector Model behavior. Mike Buetow
MONEY MATTERS
ROI No such thing as too big to fail. Peter Bigelow
Current Control Thermal Effects of IR Drop on PCBs Power distribution networks must provide adequate DC current-carrying capability, lest additional heat be generated on the board itself, yet it is difficult to design a PDN that meets the current demands of today’s ICs. But problems brought on by voltage drop, excessive current in vias, and excessive current densities can be identified and eliminated during design. Here's how. by Patrick Carrier
Panelization The PCB Array, and Why We Use It An array combines a single PCB multiple times to make a larger group of connected boards, a process sometimes referred to as “step and repeat.” The array helps an assembler load parts at a much faster rate. Follow these guidelines to set up arrays for manufacturing. by Peter Brissette
Careers The window to identify and train the next generation of designers is closing. A pair of design veterans offer their take on what to do about it. by Michael R. Creeden and Jeff Kuester
Integrated 3D Analysis Modeling 3D Effects of Signal Integrity Demand for increasingly fast computation and information transmission continues to rise, with a substantial number of designs operating at multiple Gbps range. Advanced memory designs are moving data at 10 Gbps, and the latest SerDes communication standard is reaching toward 30 Gbps. Understanding the impacts from 3D structures on signal interconnects is important, but knowing whether there is a design problem is not enough. Instead, designers must know how much the effect could be and if a design can still work without significant modification. by Dr. Zhen Mu
Design Implementation Key Rules for Design for Excellence Ample scientific work indicates that 75% to 85% of the cost of an electronic product is determined in the design phase. As the design process advances, the window of opportunity to introduce changes becomes smaller, and the cost of introducing change grows, in some cases exponentially. DfX can mitigate those costs, but only if properly implemented. by Arbel Nissan
COVER STORY Mixed Signals For designers, 2012 looks a lot like 2011, according to the results of our annual Designers’ Salary Survey. Veterans dominate the scene, and most of them are worked hard, but well-compensated for their efforts. by Chelsey Drysdale
Board Fabrication 3D Printing PCBs In practice since the 1980s, 3D printing is finally ready for prime time. Why this additive manufacturing technology is being embraced by electronics manufacturers, and what it means for PCB companies. by Richard Bartlett
Apex Expo Recap 'Trekking On' Following three tepid years in Las Vegas, a move to San Diego offered the annual trade show a new lease on life. And like the last time it was held in this Southern California city, Apex did not disappoint. Plus: Our annual SEA and NPI Award winners. by Mike Buetow
EMS Top 50 Hard Lessons Learned Mother Nature put the hurt on contract assemblers from Japan to Thailand last year, but it wasn't just gravity that brought the once high-flying Elcoteq back to earth. It was almost enough for us to overlook another year of controversy at Foxconn. (Almost.) Elcoteq notwithstanding, the 10 largest EMS companies remained mostly static in 2011. But there was plenty of movement below. by Mike Buetow
FIRST PERSON
Caveat Lector ITAR'd and feathered. Mike Buetow
MONEY MATTERS
ROI Changes in attitude. Peter Bigelow
Focus on Business Mixing generations. Susan Mucha
Forefront Going for broke. E. Jan Vardaman
TECH TALK
Designer’s Notebook Modifying the stencil layer. Duane Benson
Conformal Coatings Protecting Silicon with Silicone Silicone chemistry is a unique combination: neither purely organic (i.e., carbon-based) nor purely inorganic (i.e., silicon-based), but a molecular-level hybrid of both. The nature of the Si-O bond in the polymer backbone creates low rotation barriers and large bond energies. This inorganic polysiloxane backbone provides the foundation for building materials with superior thermal properties, environmental resistance and flexibility, even at temperatures below -70oC. New systems are more robust, faster curing and require less energy than conventional chemistry. by Brian Chambers
Data Transfer Viasystems’ Approach to CAD-to-CAM Data Transfer At Viasystems, the top issue is the amount of time required to successfully import, analyze and prepare design packages for production tooling. With full utilization of ODB++ files, the board fabricator has found it can greatly reduce the amount of manual time-consuming human interaction, and reduce opportunity for quality errors. by Kent Balius, Stephan Hackl and Julian Coates
FIRST PERSON
Caveat Lector Happy anniversary. Mike Buetow
MONEY MATTERS
ROI Secret to success. Peter Bigelow
TECH TALK
Designer’s Notebook Improving the design to fabrication handoff. Max Clark
