Log in / Register
Account Login
Register
  • Forgot Username?
  • Forgot Password?
  • The Trade Show Connection

    The Trade Show Connection

    Finding community amid chaos.  READ MORE...

  • Understanding ANOVA

    Understanding ANOVA

    Analyzing process data for accurate, defensible decisions.  READ MORE...

  • High Yield Design Practices

    High Yield Design Practices

    Building with manufacturing limits in mind.  READ MORE...

  • Rigid-Flex Design

    Rigid-Flex Design

    Rigid-flex technology is redefining electronics design.  READ MORE...

  • PCB Thermal Challenges

    PCB Thermal Challenges

    When passive heat management isn’t enough.  READ MORE...

  • NTI-100: The World’s Top PCB Fabricators

    NTI-100: The World’s Top PCB Fabricators

    The changing map of PCB production.  READ MORE...

Homepage Slideshow

  • The Trade Show Connection

    Finding community amid chaos.

    https://pcdandf.com/pcdesign/index.php/editorial/menu-features/18980-on-flying-finding-and-the-trade-show-floor

  • Understanding ANOVA

    Analyzing process data for accurate, defensible decisions.

    https://pcdandf.com/pcdesign/index.php/editorial/menu-features/18981-the-analysis-of-variance-drawing-conclusions-from-data-that-are-correct-unambiguous-and-defensible

  • High Yield Design Practices

    Building with manufacturing limits in mind.

    https://pcdandf.com/pcdesign/index.php/editorial/menu-features/18979-tried-and-true-design-practices-for-high-pcb-yield

  • Rigid-Flex Design

    Rigid-flex technology is redefining electronics design.

    https://pcdandf.com/pcdesign/index.php/current-issue/289-best-practices/18976-why-rigid-flex-pcbs-are-an-untapped-design-solution

  • PCB Thermal Challenges

    When passive heat management isn’t enough.

    https://pcdandf.com/pcdesign/index.php/current-issue/241-designer-s-notebook

  • NTI-100: The World’s Top PCB Fabricators

    The changing map of PCB production.

    https://www.pcdandf.com/pcdesign/index.php/editorial/menu-features/18878-tracking-giants-inside-the-world-s-top-pcb-fabricators

  • HOME
  • Advertising
    • Sales Contacts
    • Media Kit
  • .
  • Education
    • Archives
    • News
      • Design News
      • Fab News
      • Market News
    • New Products
    • Features
    • The Route: Printed Circuit Engineering Association News
    • Editorial Contributions
    • NPI Award
    • CIRCUITS ASSEMBLY Magazine
    • White Papers/e-Books
    • Hall of Fame
    • Printed Circuit University
  • Research
    • Market Data
    • NTI-100
    • PCB Design History
    • CAD/CAM/PCB Software Providers
    • PCB Design Engineer Salary Surveys
  • .
  • PCB Update
  • .
  • Events
    • PCB West
    • Industry Events
    • PCB2Day Workshop Series
    • PCB East
  • .
  • Subscribe
  • .
  • Search
  • Home
  • 2009 Magazine Archives
PCD&F December 2009 cover

December 2009

  • View the Digital Edition
  • IPC-2152
  • Conductor Resistance
  • Caveat Lector
  • Database
  • The Defects Database
  • Test and Inspection
  • Getting Lean
PCD&F November 2009 cover

November 2009

  • View the Digital Edition
  • Nanotechnology and Electronics Developments
  • 'Engineering is No. 1'
  • Accurate Impedance Control, Part I
  • Failure Mechanisms in Lead-Free Laminates
  • Database
  • Reliability Report
  • Designer's Notebook
  • Ad Index
  • Off the Shelf
PCD&F October 2009 cover

October 2009

  • View the Digital Edition
  • A Universal PCB Design Grid System
  • Keeping Connected
  • Embedded Passives: Debut in Prime Time
  • Database
  • Final Finish 101
  • Positive Plating
  • Designer's Notebook
  • Ad Index
  • Off the Shelf
PC&D&F September 2009 cover

September 2009

  • View the Digital Edition
  • Power Integrity: Controlling the Noise
  • Tips on Building a Signal Integrity Team
  • Our Line
  • Reliability Report
  • On the Forefront
  • Designer's Notebook
  • Ad Index
  • Off the Shelf
August 2009 PCD&F Cover

August 2009

  • Fluid Dynamic Simulation for Cool Design
  • Redefining the Role of BOM
  • Electroplating for HDI and Packaging Substrates, Part 1
  • Information Management Gaps for Board Fabrication and Assembly
  • Our Line
  • Reliability Report
  • Interconnect Strategies
  • Designer's Notebook
  • Ad Index
  • Off the Shelf

July 2009

  • Table of Contents

  • View Digital Edition
  • Subscribe

June 2009

  • Table of Contents

  • View Digital Edition
  • Subscribe

May 2009

  • Table of Contents

  • Digital Edition
  • Subscribe

April 2009

  • Table of Contents

  • Digital Edition
  • Subscribe
March 2009 PCD&F digital edition

March 2009

  • Table of Contents

  • Digital Edition
  • Subscribe
February 2009 PCD&F digital edition

February 2009

  • Table of Contents

  • Digital Edition - Design version

  • Digital Edition - Fab version

  • Subscribe
January 2009 PCD&F digital edition

January 2009

  • Table of Contents

  • Digital Edition - Design version

  • Digital Edition - Fab version

  • Subscribe

Archives

  • 2022 Issues

  • 2021 Issues

  • 2020 Issues

  • 2019 Issues

  • 2018 Issues

  • 2017 Issues

  • 2016 Issues

  • 2015 Issues

  • 2014 Issues

  • 2013 Issues

  • 2012 Issues

  • 2011 Issues

  • 2010 Issues

  • 2009 Issues

  • 2008 Issues

  • 2007 Issues

  • 2006 Issues

  • 2005 Issues

  • 2004 Issues

  • 2023 Issues

NOVEMBER ISSUE
November cover

View the Digital
Edition Here!

Press Releases

  • Schmid Announces Successful Delivery and Installation of its InfinityLine C+ System to a Leading Japanese Advanced Packaging Customer
  • Photonics Systems Group Announces Exclusive After-Hours Tech Event at Productronica 2025
  • High Density Packaging User Group Announces European Space Agency Membership
  • High-Density Packaging User Group Announces ASKPCB Membership
  • News
  • .
  • Products
  • .
  • Contacts
  • .
  • PCB Chat
  • .
  • Login

ISSN 1555-7936, Copyright © 2025 Printed Circuit Engineering Association®, PO Box 807 Amesbury MA 01913. All rights reserved. This website contains copyrighted material that cannot be reproduced without permission. Printed Circuit Engineering Association® Privacy Policy