Copper nanopaste for inter-board connections in high-layer-count PCBs that achieves 15μΩ·cm volume resistivity through low-temperature sintering in ambient atmosphere. Designed for AI servers, semiconductor inspection equipment and high-speed communication systems, SAphire B contains more than 90 wt% copper, supports screen printing and other application methods, and demonstrated less than 1% resistance change after 1,000 thermal cycles.

AI-powered design assistant that extends agentic automation beyond chip development to PCB and advanced package design. Integrated within the Allegro AI Studio, AuraStack helps engineers streamline board and package layout by coordinating thermal, signal integrity, mechanical and manufacturing analyses within a unified workflow, reducing design iterations and accelerating system development.