Revision 2015.10 of the Gerber format specification adds .FilePolarity, clarifies drawing functions, and adds entries in the syllabus of errors and bad practices.
Ucamco, www.ucamco.com
Cool-Pad CPR7154 thermal interface material dispenses like a thermal pad, but is said to show characteristics of a grease or gel when device temperatures increase to above 45°C.
CI-ONE integrates a Ka-band power amplifier and single-pole double-throw (SPDT) RF switch into a compact surface-mount module designed for satellite communication, aerospace, radar and emerging 5G/6G applications. Built using gallium arsenide (GaAs) pHEMT technology, the modules operate from a 6V supply and offer output power options of 30dBm, 34dBm and 36dBm to support 1W, 2W and 4W system architectures. Switching speeds of 5ns enable agile transmit systems while maintaining approximately 22% efficiency at the 1dB compression point. Reduces component count, simplifies RF routing and lowers thermal complexity for Ka-band front-end designs. The integrated architecture is designed to reduce module size by roughly three times while improving efficiency and cutting system costs compared with traditional discrete implementations.
Umicore introduced Auruna 8000, a nickel- and cobalt-free gold-iron high-speed electrolyte engineered for sustainable hard gold plating in high-speed and brush plating applications. The weakly acidic process produces low-porosity, wear-resistant coatings with approximately 99.7 wt.% gold and 0.3 wt.% iron, achieving hardness of about 130HV and meeting ASTM B-488-01 Type I, Code C specifications for demanding technical uses. Operating at 45–65°C with a pH range of 4.2–4.6, supports plating speeds of approximately 8µm/min and metal content from 2–30g/l (nominal 12g/l).