Ultrafast laser cutting machine portfolio supports high-precision glass processing for consumer electronics, automotive displays, optical components and wearable device manufacturing. Systems use picosecond and femtosecond laser processing for low-heat glass separation with reduced chipping, microcrack suppression and improved edge strength retention. Supports processing of ultra-thin glass, sapphire, PET, polyimide and flexible printed circuit substrates through modification-and-splitting workflows. Includes integrated motion and vision systems for shaped cuts, contour profiles and complex geometries used in foldable devices, AR/VR systems and automotive display applications.

122.88TB enterprise SSD uses proprietary Die-on-Board packaging technology to increase storage density by approximately 33% through direct NAND die mounting on the PCB. Available in 61.44TB and 122.88TB capacities for AI inference, data center and scale-out storage applications. Integrated into Huawei’s OceanStor Pacific 9926 storage platform supporting up to 11PB effective capacity with compression. Designed to maximize storage density using domestic 232-layer NAND technology for high-capacity enterprise computing environments.