Multiline ECP-8000 and ATP-7800 post-etch punch (PEP) systems designed for precision optical registration and high-throughput PCB fabrication. ECP-8000 features 8-camera alignment with punch repeatability as tight as ±0.00015” (±3.81µm) and standard production specifications of ±0.0003” to ±0.0005” (±7.62–12.7µm). System performs in-line inspection to verify image squareness and coaxial alignment between panel sides. Supports Windows 11 operation with MES and SECS/GEM integration for Industry 4.0 environments. ATP-7800 delivers up to 9+ panels per minute with punch repeatability of ±0.0005” (±12.7µm). Designed for high-volume production and backward-compatible with legacy Optiline equipment for streamlined upgrades.

550/560 Series ultra-broadband multilayer ceramic capacitors engineered for high-speed optical communication systems operating from 7kHz to 110GHz. Series now includes 15 part numbers with new 0402 capacitance values of 1nF, 10nF, 22nF and 47nF, extending working voltage ratings up to 100V. Capacitance range spans 1–220nF with ±10–100% tolerance and operating temperature from -55°C to +125°C. Devices feature one-piece rugged construction in 01005, 0201 and 0402 case sizes with tin- or gold-plated nickel barrier terminations compatible with reflow soldering. Designed for ultra-low insertion loss, flat frequency response and strong return loss performance in RF, microwave and mmWave applications. Supplied RoHS compliant on tape and reel in quantities from 500 to 20,000.