The Decode API provides automated analysis of PCB design and manufacturing data for integration into quoting, ERP and customer-facing workflows. Processes design packages to extract fabrication information, including stackups, board dimensions, drill data and DFM results from Gerber and ODB++ files, while also supporting BOM analysis, component sourcing, assembly planning and pricing. The API returns structured data covering PCB fabrication, assembly requirements and turnkey manufacturing estimates. Additional capabilities include integrated SpeedDFM analysis, version-controlled JSON schema support, BOM sourcing automation and assembly planning tools designed to streamline quoting and manufacturing workflows.

The EI-1169 conductive ink is a UV-curable, polymer-free silver formulation designed for inkjet deposition in printed electronics, semiconductor packaging and additive manufacturing applications. Engineered for strong adhesion on copper, epoxy and polyimide substrates, the ink supports low-temperature processing and stable jetting performance across industry-standard printheads. The metal-organic decomposition (MOD) ink is lead-free and halogen-free and supports UV curing at 365nm and 395nm wavelengths. Combines long shelf stability, repeatable print performance and scalable processing for digitally manufactured electronics.