Printed Circuit Design & Fab Online Magazine - Fab News

Fab News

Details: Written by Mike Buetow; Category: Fab News; Published: 28 May 2020

JIANGSU, CHINA – Production has begun at Schweizer Electronic's new EUR100 million ($100 million) printed circuit board plant here.

Details: Written by Chelsey Drysdale; Category: Fab News; Published: 26 May 2020

MILPITAS, CA – KLA Corp. formed a business group focused on growth in its electronics, packaging and components businesses. The EPC group brings together ICOS, Orbotech and SPTS Technologies to target growth opportunities in new and expanding end-markets.

Details: Written by Chelsey Drysdale; Category: Fab News; Published: 26 May 2020

CAVE CREEK, AZ – High-Density Packaging (HDP) User Group is hosting a webinar to provide the latest information on standard requirements and developments in automotive electronics. The webinar will be held June 25.

Details: Written by Chelsey Drysdale; Category: Fab News; Published: 26 May 2020

SHANGHAI –The producers of Productronica China and its related shows confirmed it will be held here as scheduled in July.

TOKYO – AGC reported first quarter electronics sales of ¥69.2 billion (US$644 million), up 16.5% year-over-year.

SANTA ANA, CA – TTM Technologies announced its board of directors has approved a restructuring plan of the company’s electromechanical business unit’s three manufacturing facilities in China.