MUNICH – Using a newly developed dielectric polymer ink and conductive ink from Nano Dimension, Hensoldt succeeded in using a 3-D printer to assemble a 10-layer PCB that carries high-performance electronic structures soldered to both outer sides.

MORRISVILLE, NC – iNEMI is presenting a call for participation webinar on its 5G/mmWave Materials Assessment and Characterization Project, Phase 1. The webinar will take place June 4 and 5.

WASHINGTON – The Semiconductor Industry Association released the following statement from president and CEO John Neuffer in response to new export control rule changes:

NORTHBROOK, IL – UL has rolled out a new assessment program to help organizations minimize supply chain cybersecurity risk by focusing on the trustworthiness of suppliers' security practices.