TOKYO – AGC reported first quarter electronics sales of ¥69.2 billion (US$644 million), up 16.5% year-over-year.

SANTA ANA, CA – TTM Technologies announced its board of directors has approved a restructuring plan of the company’s electromechanical business unit’s three manufacturing facilities in China.

MUNICH – Using a newly developed dielectric polymer ink and conductive ink from Nano Dimension, Hensoldt succeeded in using a 3-D printer to assemble a 10-layer PCB that carries high-performance electronic structures soldered to both outer sides.

MORRISVILLE, NC – iNEMI is presenting a call for participation webinar on its 5G/mmWave Materials Assessment and Characterization Project, Phase 1. The webinar will take place June 4 and 5.