PRINTED CIRCUIT DESIGN & FAB opened its 2021 New Product Introduction Awards (NPI) for printed circuit board fabrication.

TAOYUAN CITY, TAIWAN – The Covid-19 pandemic effect on numerous end-products slowed the growth rate for HDI in the first quarter, the TPCA said. Taiwanese high-end HDI makers suffered relatively minor impact, however, as the HDI sector grew 7.5%.

SCHRAMBERG, GERMANY – Shareholders in Schweizer Electronic have voted to forego distribution of dividends for the company’s fiscal 2019 in order to continue expansion investments.

BANNOCKBURN, IL – IPC and High Density Package Users Group have signed a memorandum of understanding, enabling a partnership, increased technical collaboration between groups, and a mutual path toward emerging and disruptive high-density interconnect technologies.