R-G545L/R-G545E, Prepreg R-G540L/R-G540E circuit board material is suitable for semiconductor packages and modules.
HD-EFI product series has 50Ω micro-miniature interface, said to be ideal for blind-mate situations and mating multiple RF lines between printed circuit boards.
fastRise EZpure low-temperature curing adhesive is for rigid and flex PWBs.
Sarcon 30XR-m is a high-performance thermal interface material that exhibits low thermal resistance.
A307DC visual inspection system offers fully automated defect detection.
K4000 M24 double circular blade depanelizer singulates pre-scored metal core panels.