Products

Flyover QSFP28 cable system permits sideband signaling via press-fit contacts to improve airflow, reduce loss, and mitigate skew.

Read more: Samtec Debuts Flyover QSFP28 Cable

PackagePrep CE Tin S process is for singulated QFN package side walls.

Read more: MacDermid Enthone Releases PackagePrep CE Tin S Process

Reference Gerber Viewer 2.1 supports drill files in NC or Excellon format. Fabrication data with drill files in NC format can now be viewed.

Read more: Ucamco Rolls Out Reference Gerber Viewer 2.1

Solderless vertical launch connectors are reportedly ideal for high-speed networking, high-speed computing and telecommunications applications.

Read more: Pasternack Releases Solderless Vertical Launch Connectors

Speedstack v18.08 PCB stackup design software can export and import stack-up and impedance structure data using IPC-2581B XML file format.

Read more: Polar Instruments Releases Speedstack v18.08 PCB Stackup Design Tool

TO-20 non-inductive, thick-film heat sink resistor comes in TO-220 package.

Read more: Tepro Releases TO-20 Thick-Film Heat Sink Device

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