Flyover QSFP28 cable system permits sideband signaling via press-fit contacts to improve airflow, reduce loss, and mitigate skew.
PackagePrep CE Tin S process is for singulated QFN package side walls.
Reference Gerber Viewer 2.1 supports drill files in NC or Excellon format. Fabrication data with drill files in NC format can now be viewed.
Solderless vertical launch connectors are reportedly ideal for high-speed networking, high-speed computing and telecommunications applications.
Speedstack v18.08 PCB stackup design software can export and import stack-up and impedance structure data using IPC-2581B XML file format.
TO-20 non-inductive, thick-film heat sink resistor comes in TO-220 package.